Facility Section Head

Carsem (M) Sdn. Bhd; Ipoh; Sur place; MYR 120 000 - 180 000; Plein temps

Avantages offerts par ce poste

Medical

Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Résumé du poste

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Facility Section Head to lead the operation, maintenance and continuous improvement of all M&E systems and cleanroom infrastructure.

You will oversee preventive and corrective maintenance, manage installation/commissioning activities, and drive project execution with strict safety and environmental compliance. Ideal candidates hold a Bachelor’s Degree in Engineering with 5–10 years in semiconductor facility management, and demonstrated

Qualifications

• Bachelor’s Degree in Engineering.
• 5–10 years of direct facility management experience in semiconductor/high-tech manufacturing.
• Proven leadership in facility management, M&E systems maintenance and project execution.

Responsabilités

• Lead operation, maintenance and continuous improvement of M&E systems and cleanroom infrastructure.
• Oversee preventive and corrective maintenance, installation/commissioning activities and project execution.
• Ensure safety and environmental compliance to maintain high reliability and zero downtime.
• Coordinate upgrades, retrofits and capital projects from design review to site implementation.
• Monitor schedules, budget, quality and safety for successful delivery.
• Manage procurement, installation, testing and commissioning of new equipment and infrastructure.

Connaissances

Facility management

M&E systems

Cleanroom environments

Project management

Leadership

Formation

Bachelor’s Degree in Engineering

Description du poste

The Facility Section Head will lead the operation, maintenance, and continuous improvement of all M&E systems and cleanroom infrastructure. You will oversee preventive and corrective maintenance, manage installation/commissioning activities, lead project execution, and ensure strict compliance with safety and environmental standards to maintain high reliability and zero unexpected downtime.

Key Responsibilities

Operations & Maintenance:

Manage, operate, and optimize all critical facility and utility systems, including Mechanical & Electrical (M&E), Cleanroom environments, DI Water, Scrubber, IETP, Sewage, Fire Fighting Systems, Industrial Gases, CDA, Vacuum, and Process Utilities.

Ensure all facility equipment achieves maximum uptime, reliability, and operational efficiency.

Lead troubleshooting, root cause analysis (RCA), corrective actions, and recovery efforts during breakdowns.

Coordinate, supervise, and execute facility upgrades, retrofits, and capital projects from design review to site implementation.

Monitor project schedules, manpower, budget/costs, quality, and safety to ensure successful delivery.

Manage procurement, installation, testing, and commissioning of new equipment and infrastructure.

Manage external contractors, vendors, and service providers, monitoring performance and contract execution.

Raise and process financial and procurement documentation (RFQs, PRs, PMs, MER, CER, CAF, etc.).

Identify critical spare parts requirements and maintain adequate inventory levels for business continuity.

EHS, Regulatory & Compliance:

Ensure full compliance with EHS policies, company Standard Operating Procedures (SOPs), QA/QC standards, and safety regulations.

Manage audits, inspections, permit renewals, and communications with regulatory authorities (e.g., BOMBA, DOE, DOSH, Suruhanjaya Tenaga, and relevant departments).

Supervise and mentor a team of engineers, technicians, and site contractors.

Drive energy-saving programs, ESG/sustainability initiatives, facility KPIs, and cost-optimization projects.

Support plant shutdown activities, emergency response plans, and on-call breakdown scenarios.

Job Requirements

Education: Bachelor’s Degree in Engineering (Mechanical, Electrical, Mechatronics, or related discipline).

Experience:

5 to 10 years of direct facility management experience within a Semiconductor or High-Tech Manufacturing environment.

Proven leadership experience in facility management, M&E systems maintenance, and project execution within industrial/manufacturing environments.

Perks and benefits

• Medical Education support Dental Parking Medical for immediate family members, car subsidy

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).