QA Section Manager (CQE)

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 120,000 - 180,000

Full time

7 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical
Education support
Dental
Parking
Medical for immediate family members
Car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia, is seeking a CQ Manager to lead quality operations in a fast-paced semiconductor environment.

You will manage customer complaints, drive containment actions, and coordinate with internal teams to assess risk and implement preventive actions. The role requires at least five years in semiconductor manufacturing, strong knowledge of IATF 16949, and experience with 8D, CAPA, FMEA and SPC.

Qualifications

  • Minimum 5 years in semiconductor manufacturing.
  • Experience in automotive quality tools and audits.
  • Knowledge of 8D, CAPA, FMEA, and SPC.

Responsibilities

  • Manage customer complaints and coordinate containment, risk assessment, recapture, and preventive action.
  • Monitor KPI commitments and CIP/KPI with customers.
  • Understand customer specs during account assignment.
  • Train, motivate and manage a team to develop continuous improvement programs.
  • Track key item performance, analyze data, and set corrective actions.
  • Plan and enforce quality system implementations.
  • Liaise with customers and product groups on quality concerns and feedback.
  • Collaborate with other departments to resolve quality issues.
  • Fulfill duties as assigned by supervisor.
  • Ensure QA engineer handover is complete during transfers.

Skills

Customer communication
Stakeholder mgmt
Quality leadership
Semiconductor experience
IATF 16949 knowledge

Tools

8D
CAPA
FMEA
SPC

Job description

1. Managing and handling of customer complaint, work together with internal team for containment action, risk assessment, recapturing, problem solving and preventive action.

2. Understand KPI committed to customer; Understand ongoing CIP/KPI that committed to customer.

3. Understanding of customer spec during the account assignment.

4. Train, motivate and manage a team of subordinates to develop continuous improvement programs to attain highest level of quality.

5. Track the performance of key items identified and analyze data. Establish system to prevent failures and set corrective actions to prevent recurrence of such deficiencies.

6. Plan and ensure quality systems are implemented / enforced.

7. Liaise with customers and product groups on quality concerns, programs and provide timely feedback for corrective action.

8. Work with other departments to resolve quality issues.

9. Any other duties assigned by immediate superior.

10. To ensure QA engineer requirement is fully transferred when there is hand over process.

Key Skills & Competencies for a CQ Manager

Strong customer communication and stakeholder management skills

5 years of relevant experience in semiconductor manufacturing, preferably involved semiconductor processes – wafer inspection, wafer saw, die attach, wire bonding, SMT, package saw, TnR etc.

Solid knowledge of IATF 16949, automotive quality tools, and audit requirements

Experience with 8D, CAPA, FMEA, SPC, and problem-solving methodologies

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Test Equipment Maintenance Engineer (Fresher)
Test Equipment Maintenance Engineer (Fresher)

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 32,000 - 52,000
Medical
Education support
Dental
+3
Facility Layout & Capacity Planning Section Head
Facility Layout & Capacity Planning Section Head

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 120,000 - 180,000
Medical Education support
Dental Parking Medical for immediate/1
car subsidy
Production Planner
Production Planner

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 60,000 - 90,000
Medical
Dental
Parking
+1
Senior QA Engineer
Senior QA Engineer

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 60,000 - 100,000
Medical
Education support
Dental
+3
Senior Tooling Engineer
Senior Tooling Engineer

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 120,000 - 160,000
Medical
Education support
Dental
+3
Head of R&D
Head of R&D

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 180,000 - 260,000
Medical
Education support
Dental
+2
Semiconductor Packaging Design Engineer
Semiconductor Packaging Design Engineer

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 180,000 - 260,000
Medical
Education support
Dental
+3
Sr. Test Engineering Manager
Sr. Test Engineering Manager

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 180,000 - 240,000
Medical Education support
Dental Parking
Medical for immediate family members
+1
Wire Bond Process Senior Engineer
Wire Bond Process Senior Engineer

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 78,000 - 123,000
Medical
Education support
Dental
+3
Test Operation Section Manager
Test Operation Section Manager

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 90,000 - 130,000
Medical education support
Dental
Parking
+2