Die Attach Engineer
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking a Process Engineer to evaluate process capability for new packages, materials and equipment, and to ensure production readiness.
You will provide technical solutions to process issues and drive improvements across yield, quality and productivity. The role requires coordinating cross-training for engineers, technicians and production assistants, ensuring proper material usage, and communicating changes to relevant teams with strict adherence to procedures and safety
Qualifications
- Bachelor degree in process engineering or related field.
- Minimum 2 years of relevant experience in the semiconductor industry.
Responsibilities
- Evaluate process capability for new package, material and machine to ensure production worthiness.
- Provide technical solutions to process issues.
- Coordinate cross training for engineers/technicians/production assistants and ensure proper material usage.
- Communicate changes in process and procedures to engineers/technicians and monitor compliance.
- Determine standards and materials for new equipment; work with parties to keep equipment in production mode.
- Ensure smooth shift changeover by relaying feedback on production issues to supervisors and providing timely updates to superiors.
- Liaise with production, maintenance and other support groups on new changes or product start-up.
- Develop and monitor yield, quality, productivity improvements and cost reduction programs.
- Review and ensure compliance with customer specifications and update specifications as needed.
- Lead a group during daily briefing sessions (DBS) and prepare shift performance reports.
Education
Job description
Evaluate process capability for new package, material and machine to ensure production worthiness.
Provide technical solution to process issues.
Coordinate cross training for engineers / technicians / production assistants and ensure proper usage of materials.
Communicate changes in process and procedures directly to the engineers and/or technicians and monitor to ensure compliance.
Determine standard and material for new equipment. Take initiative and work with relevant parties to ensure equipment are always in production mode.
Ensure smooth changeover of shift by providing and receiving feedback on production issues from the other supervisors. Provide timely feedback to immediate superior on production activities.
Liaise with production, maintenance and other support group staff in implementation of new changes or requirements and products start up.
Ensure discipline and safety procedures are enforced in the work areas.
Develop and monitor yield, quality, productivity improvement activities and cost reduction programs.
Review and ensure compliance of customers’ specification.
Improve process flow and update specifications to reflect changes by customer or in-house products.
Liaise with suppliers and vendors on materials and machines upgrading.
Ensure 5s implementation and enforcement.
Lead a group of people in daily briefing session (DBS).
Prepare shift performance report and updates.
Engineers / Technicians welfare and grievances are heard and attended to accordingly (always seek win-win solution)
Require to handle disciplinary issue (minor misconduct) of the engineering / production team. Issuance of a warning letter / Corrective Action Notice (CAN) with joint approval from superior when deem necessary and require to submit to HR within 14 days.
Require to handle disciplinary issue (major misconduct) of the engineering / production team. You are require to raise Incident Report on major misconduct to HR for further action and submit to HR within 14 days
Disposition of non-conforming product per procedure.
Enforce compliance to Machine Operating Procedure (MOP) and process specifications.
Risk assessment for quality issues requiring product recall.
Enforce compliance and monitor process performance.
Establish Machine Operating Procedure (MOP) for new process.
Trigger quality incidences for visibility and action.
Root cause analysis and ensure data integrity.
Communicate quality alert / changes to subordinates and peers in a timely manner.
Any other duties assigned by immediate superior
Bachelor Degree in Process Engineering or relevant discipline
Minimum 2 years of relevant working experience in the semiconductor industry
Hirer responsiveness Salary match Number of applicants
Your application will include the following questions:
- What's your expected monthly basic salary?
- How many years' experience do you have as a process engineer?
- Which of the following types of qualifications do you have?
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
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