AI Wire Bond Engineer

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 85,000 - 115,000; Full time

Benefits offered by this job

Medical Education support

Dental Parking

Medical for immediate family members

car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking an experienced Bonding Process Engineer in Ipoh to monitor bonding yield, identify root causes, and drive improvements across wedge and wire bonding processes.

You will lead DOE, FMEA, and 8D activities, develop robust process controls, and collaborate with Quality, Production, and Maintenance teams to ensure customer specifications are met and quality standards are sustained.

Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field).
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates, etc.).
• Good communication skills for customer interaction and reporting.

Responsibilities

• Monitor and analyze bonding yield, identifying root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methodologies (8D, FMEA, DOE).
• Establish and maintain key process control parameters and ensure compliance in production.
• Drive continuous yield improvement to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).
• Improve process stability and robustness against material and environmental variations.
• Conduct Design of Experiments (DOE) to validate process changes and improvements.
• Implement process standardization and best practices across production lines.
• Study and monitor bonding tool life performance and wear-out mechanisms.
• Define tool life criteria, replacement frequency, and optimization strategies.
• Collaborate with equipment and maintenance teams to ensure machine performance and uptime.
• Support equipment troubleshooting and qualification.
• Respond to customer inquiries, complaints, and technical requests in a timely manner.
• Perform failure analysis and provide clear, data-supported reports to customers.
• Participate in customer audits, technical reviews, and meetings as required.
• Ensure alignment of process capability with customer specifications and requirements.
• Maintain accurate process documentation, work instructions, and specifications.
• Prepare technical reports, yield analysis, and improvement updates.
• Ensure compliance with quality management systems and industry standards.
• Work closely with Quality, Production, Maintenance, and Engineering teams.
• Provide technical training and guidance to operators and technicians.
• Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

Skills

Wedge bonding

Wire bonding

Statistical analysis

FMEA

DOE

Customer communication

Education

Bachelor's degree in Engineering

Tools

Bonding equipment

Job description

Monitor and analyze bonding yield, identifying root causes of defects and yield loss.

Lead yield improvement activities using structured problem-solving methodologies (e.g., 8D, FMEA, DOE).

Establish and maintain key process control parameters and ensure compliance in production.

Drive continuous yield improvement to meet internal targets and customer expectations.

2. Process Robustness & Improvement

Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).

Improve process stability and robustness against material and environmental variations.

Conduct Design of Experiments (DOE) to validate process changes and improvements.

Implement process standardization and best practices across production lines.

3. Tooling & Equipment Management

Study and monitor bonding tool (capillary/wedge) life performance and wear-out mechanisms.

Define tool life criteria, replacement frequency, and optimization strategies.

Collaborate with equipment and maintenance teams to ensure machine performance and uptime.

Support equipment troubleshooting and qualification.

4. Customer Support & Technical Interface

Respond to customer inquiries, complaints, and technical requests in a timely manner.

Perform failure analysis and provide clear, data-supported reports to customers.

Participate in customer audits, technical reviews, and meetings as required.

Ensure alignment of process capability with customer specifications and requirements.

5. Documentation & Reporting

Maintain accurate process documentation, work instructions, and specifications.

Prepare technical reports, yield analysis, and improvement updates.

Ensure compliance with quality management systems and industry standards.

6. Cross-Functional Collaboration

Work closely with Quality, Production, Maintenance, and Engineering teams.

Provide technical training and guidance to operators and technicians.

Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

TECHNICAL SKILLS & COMPETENCIES

Bachelor's degree in Engineering (Electrical, Mechanical, Materials, or related field).

Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.

Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).

Familiarity with bonding equipment and materials (Al wire, substrates, etc.).

Good communication skills for customer interaction and reporting.

Perks and benefits

• Medical Education support
• Dental Parking
• Medical for immediate family members
• car subsidy

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world‑class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world‑class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).