Wirebond Process Engineer

Michael Page; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Competitive remuneration and benefits

Job summary

Michael Page is recruiting for a wirebond process engineer in Malaysia. The role focuses on stabilising wirebond processes to improve yield, productivity and reliability in a fast-paced manufacturing environment.

You will develop, qualify and optimise wirebond processes, create automated programmes, and lead root cause investigations with cross-functional teams to deliver high-impact improvements.

Qualifications

• Bachelor’s degree in engineering or related field.
• Minimum 5 years in semiconductor wirebond process engineering.
• Hands-on experience with KNS and/or ASM wirebond equipment and processes.
• Strong understanding of wirebond process optimisation and manufacturing controls.
• Knowledge of SPC, ECOs and process release methodologies.
• Proven yield improvement and root-cause analysis experience.
• Excellent communication and stakeholder management skills.

Responsibilities

• Support daily manufacturing operations and ensure stable wirebond process performance.
• Develop, qualify and optimise wirebond processes to improve yield, productivity and reliability.
• Create and maintain automated wirebond programmes and optimise wedge bonding parameters.
• Perform process characterisation, experimentation, validation and capability studies.
• Lead root cause investigations for process-related issues and quality excursions.
• Establish and maintain SPC methodologies and monitoring strategies.
• Develop technical documentation, process specs and work instructions.
• Support equipment qualification, start-ups, transfers and ramp activities.
• Drive continuous improvement projects focused on cost reduction and efficiency.

Skills

Analytical skills

Problem solving

Data interpretation

Communication

Stakeholder management

Quality assurance

Root cause analysis

SPC knowledge

Education

Bachelor’s degree in Electrical/Mechanical/Chemical/Materials Science/Physics/Chemistry or related discipline

Tools

KNS wirebond equipment

ASM wirebond equipment

Job description

Jora Malaysia will close on 16th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

• Support daily manufacturing operations and ensure stable wirebond process performance.
• Develop, qualify, and optimise wirebond processes to improve yield, productivity, quality, and reliability.
• Create and maintain automated wirebond programmes and optimise wedge bonding process parameters.
• Perform process characterisation, experimentation, validation, and capability studies.
• Analyse manufacturing and equipment performance data to identify improvement opportunities and implement corrective actions.
• Lead root cause investigations for process-related issues, quality excursions, and yield losses.
• Establish and maintain statistical process control methodologies and monitoring strategies.
• Develop and maintain technical documentation, process specifications, and work instructions.
• Support equipment qualification, process start-ups, transfers, and production ramp activities.
• Drive continuous improvement projects focused on cost reduction, operational efficiency, and process optimisation.
• Collaborate closely with production, quality, equipment engineering, and cross-functional teams to achieve business objectives.
• Support new product introductions and ensure successful transition into production.

• Support daily manufacturing operations and ensure stable wirebond process performance.
• Develop, qualify, and optimise wirebond processes to improve yield, productivity, quality, and reliability.
• Create and maintain automated wirebond programmes and optimise wedge bonding process parameters.
• Perform process characterisation, experimentation, validation, and capability studies.
• Analyse manufacturing and equipment performance data to identify improvement opportunities and implement corrective actions.
• Lead root cause investigations for process-related issues, quality excursions, and yield losses.
• Establish and maintain statistical process control methodologies and monitoring strategies.
• Develop and maintain technical documentation, process specifications, and work instructions.
• Support equipment qualification, process start-ups, transfers, and production ramp activities.
• Drive continuous improvement projects focused on cost reduction, operational efficiency, and process optimisation.
• Collaborate closely with production, quality, equipment engineering, and cross-functional teams to achieve business objectives.
• Support new product introductions and ensure successful transition into production.

Join a Global Semiconductor PowerhouseDrive Meaningful Manufacturing Impact

• Bachelor's Degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related discipline.
• Minimum 5 years of experience in semiconductor wirebond process engineering.
• Hands-on experience with KNS and/or ASM wirebond equipment and processes.
• Strong understanding of wirebond process optimisation, process qualification, and manufacturing controls.
• Knowledge of Statistical Process Control (SPC), engineering change management, and process release methodologies.
• Proven experience in yield improvement, quality enhancement, process troubleshooting, and root cause analysis.
• Strong analytical, problem-solving, and data interpretation skills.
• Excellent communication and stakeholder management capabilities.
• Self-motivated, results-oriented, and able to thrive in a fast-paced manufacturing environment.

Our client is a multinational semiconductor company with a strong global presence and a reputation for engineering innovation, manufacturing excellence, and technology leadership. Serving customers across numerous industries, the organisation continues to invest heavily in advanced manufacturing capabilities, employee development, and continuous improvement initiatives.

• Opportunity to join a leading global semiconductor manufacturer.
• Exposure to advanced semiconductor assembly and packaging technologies.
• High-impact role with strong ownership and visibility across manufacturing operations.
• Collaborative environment that values innovation and continuous improvement.
• Opportunities to work on challenging engineering projects and new technology deployments.
• Professional development and career growth within a global organisation.
• Competitive remuneration and benefits package.