Senior Packaging Development Engineer - Substrate Modules

Texas Instruments Incorporated; Malacca City; On-site; MYR 60,000 - 90,000; Full time

Job summary

Texas Instruments Incorporated in Malaysia's SC Packaging team offers high visibility on projects with strong opportunities for growth within the team and across the SC Packaging organization. You will interact with multiple product groups and functions to advance packaging capabilities.

Responsibilities include optimizing process parameters for attach processes, defining manufacturing sequences, leading new product executions from kick-off through RTM, coordinating with factory operations to

Responsibilities

• Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology.
• Defining simplified manufacturing process sequence for different components attach.
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation.
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements.
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs.
• Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment.

Job description

Change the world. Love your job.

As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.

Responsibilities may include:

• Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
• Defining simplified manufacturing process sequence for different components attach
• Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation
• Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment