Senior Packaging Development Engineer

Monolithic Power Malaysia Sdn. Bhd.; Penang; On-site; MYR 100,000 - 167,000; Full time

Benefits offered by this job

Supportive work environment where your

World of opportunities for your career

Job summary

Monolithic Power Malaysia Sdn. Bhd. in Penang seeks a design engineer to design, develop and scale new packages and modules for industrial, automotive, renewable and telecom markets.

You will translate system requirements into package definitions, collaborate with internal teams and suppliers, optimize materials, and pursue new technologies to maximize performance, reliability and manufacturability. Strong communication and problem-solving skills are essential to support multiple product lines

Qualifications

• BS or MS in Mechanical, Materials Science, Electrical Engineering or related engineering degree.
• 3+ years of experience designing packages and modules.
• Proficient in AutoCAD and SolidWorks.
• Strong understanding of packaging technologies, process flow, materials, qualification and manufacturing.
• Knowledge of thermal, electrical and mechanical FEA/CFD simulation tools and methods for semiconductor packaging.

Responsibilities

• Design, develop and scale to volume production of new packages and modules.
• Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.
• Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.
• Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.
• Direct support for multiple product lines and customers.

Skills

Package design

Communication skills

Problem solving

Innovation mindset

Collaboration

Presentation skills

Education

BS or MS in Mechanical, Materials Science, Electrical Engineering or related engineering degree

Tools

AutoCAD

SolidWorks

ANSYS Icepak

ANSYS Q3D

ANSYS Mechanical

Job description

Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.

The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications.

Capabilities to independently use simulation software.

Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.

Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.

Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.

Direct support for multiple product lines and customers.

REQUIREMENTS

BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree.

3+ years of experience in design of packages and modules.

Proficiency in CAD software: Auto CAD and SolidWorks preferred.

Deep understanding in various packaging technologies, process flow, material, qualification and manufacturing implementation.

Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.

ANSYS Icepak/Q3D/Mechanical Preferred.

System level simulation skill is a plus.

Excellent communication, writing and presentation skills.

Strong innovation, problem solving mindset.

• Supportive work environment where your ideas count, and you can thrive in a diverse culture.
• World of opportunities for your personal and professional development.