Senior Chip Fab Process Engineer: Yield & HVM Lead

Broadcom

George Town

On-site

MYR 180,000 - 300,000

Full time

16 hours ago
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Job summary

Broadcom in Malaysia seeks a Process Engineer to own chip fab backend processes for laser devices, overseeing subcontractor operations and acting as the technical authority for scribe, brake, stacking, and unstacking.

You will drive tool qualification, NPI, and process transfers, ensuring quality, yield, and efficiency across regions and suppliers while maintaining data-driven governance and CAPA programs.

Qualifications

  • Master's degree in Engineering (Physics, Electrical, or Mechanical).
  • 5–15 years in backend semiconductor processes with dicing, scribe & cleave, PnP, AVI tools, burn-in, wafer mounting.
  • Strong knowledge of SPC, DOE, FMEA, DMAIC; JMP, Tableau, and SQL.
  • Experience with laser manufacturing principles using InP and GaAs materials.
  • Proficient in JMP scripting and data analysis for reporting automation.

Responsibilities

  • Serve as technical lead for wafer scribing, stacking, and unstacking backend operations.
  • Oversee day-to-day subcontractor manufacturing operations across regions with remote monitoring.
  • Define requirements for new tool acquisitions and engineering upgrades with suppliers.
  • Collaborate to drive UPH improvement and overall process efficiency.
  • Lead buy-off and qualification of new equipment for production scaling.
  • Drive NPI and transfer processes from design to high-volume manufacturing.
  • Establish process qualification methods and present data to stakeholders.
  • Perform root-cause analysis and implement CAPA to resolve excursions.
  • Define SPC strategies, FMEA, OCAP, and data-driven process control plans.
  • Partner with cross-functional teams and external foundries to align goals.
  • Analyze yield detractors and optimize equipment utilization to reduce cost-per-die.
  • Create dashboards and KPIs to monitor backend processes and report to management.
  • Develop SOPs and technical reports for backend processes.

Skills

SPC & DOE
FMEA
Data Analysis
Process Improvement
JMP
Tableau
SQL
AutoCAD
SolidWorks

Education

Master's Degree in Engineering

Tools

JMP
Tableau
SQL
AutoCAD
SolidWorks

Job description

Broadcom in Malaysia seeks a Process Engineer to own chip fab backend processes for laser devices, overseeing subcontractor operations and acting as the technical authority for scribe, brake, stacking, and unstacking.

You will drive tool qualification, NPI, and process transfers, ensuring quality, yield, and efficiency across regions and suppliers while maintaining data-driven governance and CAPA programs.

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