Senior ChipFab Process Engineer - Backend Laser Manufacturing

Broadcom, Inc.; Penang; On-site; MYR 120,000 - 240,000; Full time

Job summary

Broadcom, Inc. is seeking a Process Engineer to own Chip Fab backend processes for laser devices, overseeing subcontractor operations and ensuring on-time shipments. You will lead scribe & cleave, stacking/unstacking, and drive tool qualification to scale production.

Qualified candidates bring extensive experience with dicing, PnP, burn-in, and precision engineering, plus strong data analysis, SPC/DOE/FMEA knowledge, and proficiency in JMP/Tableau/SQL. AutoCAD/SolidWorks experience is a plus.

Qualifications

• Master’s Degree in Engineering (Physics, Electrical, or Mechanical)
• 5–15 years in backend processes with hands-on experience in dicing, scribe & cleave, PnP, automated bar-handling, AVI tools, burn‑in, wafer mounting tools, hoop ring tape transfers, and mechanical/precision engineering concepts
• Strong fundamentals in statistics and working knowledge of SPC, DOE, FMEA, DMAIC, and tools like JMP, Tableau, and SQL
• Demonstrated knowledge of process capability indices (Cpk, Ppk), equipment reliability metrics (MTBA, MTBF), and tool-to-tool performance comparisons
• Solid knowledge of laser manufacturing using InP and GaAs materials (DFB, EML, VCSEL)
• Strong data analysis skills with JMP scripting and data reporting automation
• Energetic, resilient leader with interpersonal and presentation skills
• Experience in AutoCAD and SolidWorks is a plus

Responsibilities

• Serve as the technical lead for wafer scribing, stacking, and unstacking backend operations
• Oversee day-to-day subcontractor manufacturing operations across regions using remote monitoring
• Be primary technical contact for equipment suppliers and define requirements for new tools and upgrades
• Drive UPH accuracy and overall efficiency through engineering improvements
• Lead buy-off and qualification of new equipment to support production scaling
• Drive New Process Integration (NPI) and process transfers to high-volume manufacturing
• Lead change management with rigorous qualification methods and data-driven approvals
• Perform root-cause analysis and implement CAPA to resolve process excursions
• Define process control plans, SPC, FMEA, and OCAP for backend processes
• Collaborate with cross-functional teams and external foundries to align goals
• Analyze yield detractors, optimize equipment utilization, and reduce cost-per-die
• Establish dashboards and KPIs to monitor wafer scribe and laser stack/unstack processes
• Create SOPs, technical reports, and data analysis documents

Skills

Statistics

SPC

DOE

FMEA

DMAIC

JMP

Tableau

SQL

Data analysis

Communication

Education

Master's Degree in Engineering

Tools

AutoCAD

SolidWorks

Job description

Broadcom, Inc. is seeking a Process Engineer to own Chip Fab backend processes for laser devices, overseeing subcontractor operations and ensuring on-time shipments. You will lead scribe & cleave, stacking/unstacking, and drive tool qualification to scale production.

Qualified candidates bring extensive experience with dicing, PnP, burn-in, and precision engineering, plus strong data analysis, SPC/DOE/FMEA knowledge, and proficiency in JMP/Tableau/SQL. AutoCAD/SolidWorks experience is a plus.