Chip Fab Process Engineer: Ramp-Up & Yield Excellence

Broadcom; George Town; Sur place; MYR 180 000 - 300 000; Plein temps

Résumé du poste

Broadcom in Penang, Malaysia seeks a senior manufacturing engineer to lead the ramp-up of new facilities and manage cross-functional teams across CM partners, equipment, and processes for mass production. You will drive product transfers from NPI to HVM and push continuous yield improvements.

The role requires 10+ years in backend semiconductor/photonics manufacturing, strong leadership, and expert JMP analytics to guide decision making and issue resolution on the factory floor.

Qualifications

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering or related highly technical field.
• 10+ years hands-on engineering and leadership in backend semiconductor/photonics manufacturing.
• Experience leading remote teams and cross-functional initiatives.
• Expertise in yield improvement methodologies and equipment qualification.
• Proficient in JMP for statistical data analysis and decision making.

Responsabilités

• Lead ramp-up of new facilities and aggressive capacity scaling within tight timelines.
• Direct evaluation and onboarding of CM partners, equipment, and processes for mass production.
• Own seamless product transfer from NPI to High-Volume Manufacturing (HVM).
• Monitor and improve production yields across contract manufacturers.
• Resolve CM engineering, production, and quality issues with corrective actions.
• Oversee product costing and identify opportunities for cost reduction.
• Analyze CM performance data and troubleshoot manufacturing deviations.
• Drive on-site quality audits and enforce SOPs, PCPs, and quality standards.

Connaissances

Leadership

Data analysis

JMP

Cross-functional

Formation

Engineering degree (Mechanical/EE)

Semiconductor manufacturing background

Outils

JMP software

Bar processing equipment

AOI

Pick & Place

Description du poste

Broadcom in Penang, Malaysia seeks a senior manufacturing engineer to lead the ramp-up of new facilities and manage cross-functional teams across CM partners, equipment, and processes for mass production. You will drive product transfers from NPI to HVM and push continuous yield improvements.

The role requires 10+ years in backend semiconductor/photonics manufacturing, strong leadership, and expert JMP analytics to guide decision making and issue resolution on the factory floor.