ChipFab Ramp-Up Engineer: Yield & NPI to HVM

Broadcom Inc.; George Town; Sur place; MYR 120 000 - 180 000; Plein temps

Résumé du poste

Broadcom Inc. in Penang, Malaysia, is seeking a ChipFab Product Engineer to lead ramp-up of new facilities, drive qualification of CM partners, and ensure smooth transfer from NPI to high-volume manufacturing.

You will monitor yields, solve CM production issues, and oversee cost reductions through process improvements, data-driven analysis with JMP, and strong cross-functional leadership. The role demands extensive technical background in semiconductor/photonics and proven ability to manage

Qualifications

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or related highly technical field.
• 10+ years hands-on engineering and leadership in backend Indium Phosphide InP wafer processing or complex semiconductor/photonics manufacturing.
• Experience leading remote teams and ramping new facilities or production lines.
• Strong expertise in product and process yield improvement and equipment qualification.
• Proficiency in JMP for statistical data analysis and decision-making.
• Excellent communication, negotiation, and project management skills.

Responsabilités

• Lead the team to ramp-up new facilities, ensuring capacity scaling within strict project timelines.
• Lead cross functional evaluation and onboarding of CM partners, new equipment, and manufacturing processes to ensure seamless transition into mass production.
• Drive seamless transfer of products from New Product Introduction to High-Volume Manufacturing, acting as technical owner for issues on the factory floor.
• Monitor production yields across contract manufacturers and drive for improvements.
• Resolve CM engineering, production, and quality issues with robust corrective actions and continuous process improvement initiatives.
• Oversee product costing analysis and identify opportunities for cost reduction through process optimization and yield enhancement.
• Drive data-driven engineering analysis to monitor CM performance and troubleshoot manufacturing deviations.
• Conduct on-site quality audits at partner facilities to enforce SOPs/PCPs and quality standards; lead root cause investigations and track corrective actions.

Connaissances

Leadership

Cross-functional collaboration

Data analysis

Communication

Formation

Engineering degree (Mechanical / E&E / Semiconductor / Photonics)

Outils

JMP

Description du poste

Broadcom Inc. in Penang, Malaysia, is seeking a ChipFab Product Engineer to lead ramp-up of new facilities, drive qualification of CM partners, and ensure smooth transfer from NPI to high-volume manufacturing.

You will monitor yields, solve CM production issues, and oversee cost reductions through process improvements, data-driven analysis with JMP, and strong cross-functional leadership. The role demands extensive technical background in semiconductor/photonics and proven ability to manage