Chip Fab Backend Process Engineer — Scribe/Stacking & NPI

Broadcom Inc.; Penang; On-site; MYR 180,000 - 240,000; Full time

Benefits offered by this job

Medical Education support

Dental

Parking

Vision

Stock Grants, Stock Options

Lunch Subsidy

Job summary

Broadcom Inc. is seeking a Process Engineer to own Chip Fab backend processes for laser devices, driving productivity, yield, quality, and reliability across subcontractor facilities.

You will act as Resident Engineer, overseeing day‑to‑day operations and serving as the technical authority for scribe, brake, stacking, and unstacking processes. You will manage capacity expansion via new tool qualification, ensure R&D to high-volume manufacturing transitions, and collaborate with cross‑functional

Qualifications

• Master’s degree in engineering (Physics, Electrical or Mechanical).
• 5–15 years in backend processes with hands-on experience in wafer scribing, dicing, cleave, PnP, automated bar-handling, AVI tools, burn-in, wafer mounting tools.
• Strong fundamentals in statistics and tools like JMP, Tableau, SQL; knowledge of SPC, DOE, FMEA, DMAIC.
• Experience with laser manufacturing principles (DFB, EML, VCSEL) using InP/GaAs materials.
• Excellent data analysis, reporting automation, and ability to present to leadership.

Responsibilities

• Lead wafer scribing, stacking, and unstacking backend operations as technical lead.
• Oversee subcontractor manufacturing operations internationally as Resident Engineer.
• Define requirements for new tools and engineering upgrades with equipment suppliers.
• Drive NPIs and process transfers from design to high‑volume manufacturing.

Skills

Data analysis

SPC

DOE

SQL

JMP

Python

Leadership

Education

Master’s Degree in Engineering (Physics, Electrical or Mechanical)

Tools

AutoCAD

SolidWorks

Job description

Broadcom Inc. is seeking a Process Engineer to own Chip Fab backend processes for laser devices, driving productivity, yield, quality, and reliability across subcontractor facilities.

You will act as Resident Engineer, overseeing day‑to‑day operations and serving as the technical authority for scribe, brake, stacking, and unstacking processes. You will manage capacity expansion via new tool qualification, ensure R&D to high-volume manufacturing transitions, and collaborate with cross‑functional