ChipFab Process Engineer — Ramp-Up & Yield Leader

Broadcom Inc.; Seberang Perai; On-site; MYR 180,000 - 300,000; Full time

Job summary

Broadcom Inc. seeks a ChipFab Process Engineer in Malaysia's Penang facility to lead ramp-up of new facilities and drive aggressive capacity scales within tight timelines.

The role involves cross-functional qualification of new CM partners, equipment, and processes, plus ownership of NPI-to-HVM transitions and ongoing yield improvement across contract manufacturers. You will manage cost analyses, monitor CM performance with JMP, and ensure on-site quality audits while coordinating with remote

Qualifications

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.
• Minimum 10+ years of hands-on engineering and leadership in backend Indium Phosphide InP wafer processing or complex semiconductor/photonics manufacturing.
• Experience leading remote teams, cross-functional initiatives, and ramp-ups of new facilities or production lines.
• Strong knowledge of yield improvement methodologies, problem solving, and equipment qualification.

Responsibilities

• New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities within strict timelines.
• New Equipment, Process & CM Qualification: Lead cross functional evaluation and onboarding of CM partners and new processes.
• New Product Transfer & Technical Ownership: Drive NPI to HVM transitions and own product-related issues on the floor.
• Yield Stabilization & Enhancement: Monitor yields and drive improvements across CM partners.
• Data-Driven Engineering Analysis: Use JMP for complex statistical data analysis and decision making.
• Customer Quality Assurance: Conduct on-site quality audits and drive corrective actions with CMs.

Skills

Leadership

Data analysis

Problem solving

Communication

Education

Engineering degree

Tools

JMP software

Job description

Broadcom Inc. seeks a ChipFab Process Engineer in Malaysia's Penang facility to lead ramp-up of new facilities and drive aggressive capacity scales within tight timelines.

The role involves cross-functional qualification of new CM partners, equipment, and processes, plus ownership of NPI-to-HVM transitions and ongoing yield improvement across contract manufacturers. You will manage cost analyses, monitor CM performance with JMP, and ensure on-site quality audits while coordinating with remote