Senior/Staff ChipFab Process Engineer

5034 Avago Technologies (Malaysia) Sdn. Bhd.; Penang; On-site; MYR 120,000 - 240,000; Full time

Job summary

Broadcom, Inc. is seeking a Process Engineer to own Chip Fab backend processes for laser devices, overseeing subcontractor operations and ensuring on-time shipments. You will lead scribe & cleave, stacking/unstacking, and drive tool qualification to scale production.

Qualified candidates bring extensive experience with dicing, PnP, burn-in, and precision engineering, plus strong data analysis, SPC/DOE/FMEA knowledge, and proficiency in JMP/Tableau/SQL. AutoCAD/SolidWorks experience is a plus.

Qualifications

• Master’s Degree in Engineering (Physics, Electrical, or Mechanical)
• 5–15 years in backend processes with hands-on experience in dicing, scribe & cleave, PnP, automated bar-handling, AVI tools, burn‑in, wafer mounting tools, hoop ring tape transfers, and mechanical/precision engineering concepts
• Strong fundamentals in statistics and working knowledge of SPC, DOE, FMEA, DMAIC, and tools like JMP, Tableau, and SQL
• Demonstrated knowledge of process capability indices (Cpk, Ppk), equipment reliability metrics (MTBA, MTBF), and tool-to-tool performance comparisons
• Solid knowledge of laser manufacturing using InP and GaAs materials (DFB, EML, VCSEL)
• Strong data analysis skills with JMP scripting and data reporting automation
• Energetic, resilient leader with interpersonal and presentation skills
• Experience in AutoCAD and SolidWorks is a plus

Responsibilities

• Serve as the technical lead for wafer scribing, stacking, and unstacking backend operations
• Oversee day-to-day subcontractor manufacturing operations across regions using remote monitoring
• Be primary technical contact for equipment suppliers and define requirements for new tools and upgrades
• Drive UPH accuracy and overall efficiency through engineering improvements
• Lead buy-off and qualification of new equipment to support production scaling
• Drive New Process Integration (NPI) and process transfers to high-volume manufacturing
• Lead change management with rigorous qualification methods and data-driven approvals
• Perform root-cause analysis and implement CAPA to resolve process excursions
• Define process control plans, SPC, FMEA, and OCAP for backend processes
• Collaborate with cross-functional teams and external foundries to align goals
• Analyze yield detractors, optimize equipment utilization, and reduce cost-per-die
• Establish dashboards and KPIs to monitor wafer scribe and laser stack/unstack processes
• Create SOPs, technical reports, and data analysis documents

Skills

Statistics

SPC

DOE

FMEA

DMAIC

JMP

Tableau

SQL

Data analysis

Communication

Education

Master's Degree in Engineering

Tools

AutoCAD

SolidWorks

Job description

Job Summary As a Process Engineer, you will own the Chip Fab backend processes for laser devices, driving productivity, yield, quality, and reliability across subcontractor facilities. Acting as a Resident Engineer, you will oversee day-to-day subcontractor operations to ensure shipment commitments are consistently met. You will serve as the technical authority for Scribe & Brake, Stacking, and Unstacking processes, manage capacity expansion through new tool qualification, and ensure a seamless transition from R&D to high-volume manufacturing (HVM).

Key Responsibilities

• Serve as the technical lead and key decision-maker for wafer scribing, stacking, and unstacking backend operations.
• Act as a Resident Engineer to oversee day-to-day subcontractor manufacturing operations across regions, utilizing remote monitoring to ensure consistent performance.
• Act as the primary technical point of contact for equipment suppliers, defining requirements for new tool acquisitions and engineering upgrades.
• Collaborate with equipment suppliers to demand error-free processes and drive engineering improvements for Units Per Hour (UPH) accuracy and overall operational efficiency.
• Lead the buy-off and qualification of new equipment to support production scaling, collaborating closely with Product, Quality, and R&D teams.
• Drive New Process Integration (NPI) and formal process transfers from the design phase to high-volume manufacturing.
• Lead change management initiatives by establishing rigorous process change qualification methods and presenting comprehensive data to stakeholders for approval.
• Perform deep-dive root cause analysis and implement robust Corrective and Preventive Actions (CAPA) to resolve process excursions and eliminate defect sources.
• Define and execute comprehensive process control plans, including Statistical Process Control (SPC) strategies, FMEA, and Out-of-Control Action Plans (OCAP).
• Partner with cross-functional teams (equipment, integration, quality, R&D) and external foundries to align technical goals with operational strategies.
• Analyze statistical data to identify yield detractors, optimize equipment utilization, and improve operational efficiency to lower the cost-per-die.
• Establish dashboards and KPIs to track the health of wafer scribe and laser bar stack/unstack processes; monitor daily cycle times, flag critical issues immediately, and provide periodic management reports.
• Create and maintain Standard Operating Procedures (SOPs), technical reports, change management documents, and data analysis for assigned backend processes.

Qualifications

• Master’s Degree in Engineering (Physics, Electrical Engineering, or Mechanical Engineering).
• 5–15 years in backend processes, including 5+ years of hands‑on experience with dicing, scribe & cleave, Pick-and-Place (PnP), automated bar-handling, AVI tools, burn‑in processes, wafer mounting tools, hoop ring tape transfers, and mechanical/precision engineering concepts.
• Strong fundamentals in statistics and working knowledge of SPC, DOE, FMEA, DMAIC, as well as advanced tools such as JMP, Tableau, and SQL.
• Demonstrated knowledge of process capability indices (Cpk, Ppk), equipment reliability metrics (MTBA, MTBF), and statistical comparison of tool-to-tool performance.
• Solid knowledge of laser (DFB, EML, VCSEL) manufacturing principles using InP (Indium Phosphide) and GaAs (Gallium Arsenide) materials.
• Strong data analysis skills with the ability to swiftly handle, join, filter, and group large datasets for critical business decisions, alongside proficiency in JMP scripting and programming for data analysis and reporting automation.
• Energetic, resilient leader with excellent interpersonal and presentation skills, capable of communicating complex data effectively to leadership and adapting to high‑stress, fast‑paced environments.
• Experience in AutoCAD and SolidWorks is an added advantage.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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