Semiconductor Process & Equipment Tech – Wire Bonding

Globetronics Sdn. Bhd.; Bayan Lepas; Presencial; MYR 42.000 - 72.000; Jornada completa

Descripción de la vacante

Globetronics Sdn. Bhd. is seeking a Process & Equipment Technician with hands-on experience in Wire Bonding, AOI, Underfill, Dicing, Dispensing, and Asymtek equipment to support daily production operations and continuous improvement.

The role emphasizes machine setup, troubleshooting, and quality assurance within a cleanroom environment. The candidate should have 1–5 years in semiconductor or manufacturing, be able to perform basic machine adjustments, and work in shift arrangements to maintain

Formación

• Hands-on semiconductor process and equipment experience required.
• Experience with Wire Bonding, AOI, Underfill, Dicing or related processes preferred.
• Familiarity with semiconductor assembly equipment setup and troubleshooting.

Responsabilidades

• Operate, set up, and monitor semiconductor equipment according to SOPs and work instructions.
• Perform and support processes including Wire Bonding, AOI, Underfill, Dicing/Wafer Sawing, Dispensing and Asymtek equipment operation.
• Perform machine setup, changeover, recipe verification and parameter adjustments.

Conocimientos

Wire Bonding

AOI

Underfill

Dispensing

Wafer Sawing

Educación

SPM / Diploma in Engineering or related field

Herramientas

Asymtek equipment

Dispensing equipment

Descripción del empleo

Globetronics Sdn. Bhd. is seeking a Process & Equipment Technician with hands-on experience in Wire Bonding, AOI, Underfill, Dicing, Dispensing, and Asymtek equipment to support daily production operations and continuous improvement.

The role emphasizes machine setup, troubleshooting, and quality assurance within a cleanroom environment. The candidate should have 1–5 years in semiconductor or manufacturing, be able to perform basic machine adjustments, and work in shift arrangements to maintain