Process & Equipment Technician – Wire Bond / Underfill / Dicing / AOI

Globetronics Sdn. Bhd.; Bayan Lepas; On-site; MYR 42,000 - 72,000; Full time

Job summary

Globetronics Sdn. Bhd. is seeking a Process & Equipment Technician with hands-on experience in Wire Bonding, AOI, Underfill, Dicing, Dispensing, and Asymtek equipment to support daily production operations and continuous improvement.

The role emphasizes machine setup, troubleshooting, and quality assurance within a cleanroom environment. The candidate should have 1–5 years in semiconductor or manufacturing, be able to perform basic machine adjustments, and work in shift arrangements to maintain

Qualifications

• Hands-on semiconductor process and equipment experience required.
• Experience with Wire Bonding, AOI, Underfill, Dicing or related processes preferred.
• Familiarity with semiconductor assembly equipment setup and troubleshooting.

Responsibilities

• Operate, set up, and monitor semiconductor equipment according to SOPs and work instructions.
• Perform and support processes including Wire Bonding, AOI, Underfill, Dicing/Wafer Sawing, Dispensing and Asymtek equipment operation.
• Perform machine setup, changeover, recipe verification and parameter adjustments.

Skills

Wire Bonding

AOI

Underfill

Dispensing

Wafer Sawing

Education

SPM / Diploma in Engineering or related field

Tools

Asymtek equipment

Dispensing equipment

Job description

Process & Equipment Technician – Wire Bond / Underfill / Dicing / AOI

We are seeking an experienced Semiconductor Process & Equipment Technician with hands‑on experience in Wire Bonding, AOI, Underfill, Dicing, Dispensing, and Asymtek equipment. The successful candidate will support daily production operations, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable production, high product quality, and operational efficiency.

Key responsibilities

Operate, set up, and monitor semiconductor manufacturing and assembly equipment according to SOPs and work instructions.

Perform and support semiconductor processes, including Wire Bonding, AOI, Underfill, Dicing / Wafer Sawing, Dispensing, and Asymtek dispensing equipment operation.

Perform machine setup, product changeover, recipe verification, and process parameter adjustments.

Monitor equipment performance, production output, and product quality.

Troubleshoot machine and process abnormalities and implement corrective actions.

Conduct visual inspections and identify process defects such as wire bonding defects, voids, delamination, die chipping, and dispensing irregularities.

Support preventive maintenance, equipment cleaning, and basic equipment adjustments.

Assist Engineers with process qualification, NPI, engineering trials, and continuous improvement activities.

Maintain accurate production, process, and equipment records.

Work closely with Production, Process Engineering, Equipment Engineering, and QA teams to resolve production issues.

About you

Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.

1–5 years of relevant experience in semiconductor, electronics, or manufacturing industry.

Hands‑on experience in one or more of the following processes: Wire Bonding, Underfill, Dicing / Wafer Sawing, Dispensing, or Asymtek equipment.

Experience in semiconductor assembly equipment setup and troubleshooting.

Good understanding of semiconductor manufacturing processes and production requirements.

Able to perform basic machine adjustments and process parameter verification.

Willing to work in a cleanroom and shift environment.

Good teamwork, communication, discipline, and problem‑solving skills.

Vision

To Be The Global Business Partner of Choice In Niche Products And Services.

Mission

To Deliver Continuous Growth And Breakthroughs In Business Performance With Total Customer Satisfaction.

Belief

People Are Our Greatest Assets

Results Oriented With Customer Satisfaction

Organizational Agility

Integrity At All Times

Team-Based Approach

Founded in 1991 by 2 ambitious entrepreneurs, Globetronics has grown rapidly over the last 20 years from one humble 20,000 sq.ft. rented facility to ten buildings covering more than 600,000 sq.ft., with over 2,500 employees.

The major shareholders of Globetronics include Wiserite Sdn. Bhd. and Lembaga Tabung Haji. Globetronics was listed on the Kuala Lumpur Stock Exchange (KLSE 7022 GTRONIC) on 3 November 1997.

Machinery & Automation 1,001-5,000 employees