Regional Technical Manager - Electronics & SMT Support

Indium Corporation Of America

Kuala Lumpur

On-site

MYR 180,000 - 240,000

Full time

47 hours ago
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Benefits offered by this job

Medical
Dental
Parking
Contractual Bonus
Birthday Leave
Insurance Coverage

Job summary

Indium Corporation is seeking an Area Technical Manager in Malaysia to provide technical support for sales, lead regional technical services, and foster growth in staff within the territory. You will collaborate with customers, distributors and internal teams to drive innovative applications and extend existing technologies.

Ideal candidates have 5 years in process engineering in semiconductor packaging/SMT, strong English communication, and a proven leadership record.

Qualifications

  • 5 years of experience in a process engineering role in semiconductor packaging or SMT.
  • Excellent interpersonal and communication skills.
  • Strong written and spoken English skills.
  • Travel within the region as needed.
  • Leadership abilities and customer/supplier relationship knowledge.
  • Knowledge of SPC, troubleshooting and 8D reports is a plus.

Responsibilities

  • Render technical support to sales activities and provide on-site evaluations.
  • Lead technical services for the assigned territory and mentor staff if any.
  • Offer product/process recommendations and troubleshoot issues.
  • Educate and train customers, distributors, and internal teams.
  • Act as a technical spokesperson for Indium Corporation.
  • Develop networks across technical, manufacturing, engineering, R&D, and marketing.

Skills

Interpersonal skills
English communication
Leadership
Customer relationships

Education

Bachelor/Master in Electrical/Electronics/Chemical/Materials Eng

Tools

SPC
8D reports

Job description

Indium Corporation is seeking an Area Technical Manager in Malaysia to provide technical support for sales, lead regional technical services, and foster growth in staff within the territory. You will collaborate with customers, distributors and internal teams to drive innovative applications and extend existing technologies.

Ideal candidates have 5 years in process engineering in semiconductor packaging/SMT, strong English communication, and a proven leadership record.

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