Packaging Engineer (Process Module Development)

SanDisk; Batu Kawan; On-site; MYR 60,000 - 90,000; Full time

Job summary

SanDisk Penang PTDI division seeks a Packaging Engineer (Process Module Development) to advance SSD packaging and material processes for next‑gen products at the Batu Kawan facility. You will lead pathfinding, qualification, and ramp to high‑volume production, interfacing with suppliers and internal teams.

You will apply DOE, metrology and statistical tools to improve quality, yield, and cost, while coordinating new process introductions and ensuring robust reliability across product families.

Qualifications

• Bachelor/Master in Mechanical/Electrical/Material Science/Engineering required.
• 5 years of relevant work experience within semiconductor industry.
• Experience in SMT material and process development preferred.
• Strong problem-solving with DOE and metrology knowledge.
• Excellent cross-functional collaboration and communication.

Responsibilities

• Defines IC package/SMT/SSD drive requirements, goals and milestones for SSD product groups.
• Develops SSD assembly and IC packaging material and processes to meet quality and yield goals.
• Creates package and SMT process qualification programs.
• Updates specifications for ICs and semiconductor assemblies.
• Plans experiments to characterize materials and processes from pathfinding to ramp.
• Improves quality, reliability, cost, yield and productivity using statistical tools.
• Establishes process control systems and product recipes.
• Transfers processes to high volume manufacturing and supports new factory start-up.
• Acts as liaison with suppliers/vendors.
• Maintains product quality while introducing cost-reduction programs.
• Coordinates introduction of new package processes into production.

Skills

AI/ML experience

Machine fingerprinting

Statistical analysis

Verbal and written communications

Team leadership

Education

Bachelor/Master in Mechanical/Electrical/Materials Science/Engineering

Tools

Minitab

JMP

Job description

General Information

Job Name

Packaging Engineer (Process Module Development)

Country/Region

Malaysia

State

Pulau Pinang (Penang)

City

Batu Kawan

Work Location

Penang SDSM Office

Work Mode

Employees work on-site

Exemption Status

Exempt

Business Function

Packaging Engineering

Employment Type

Full-time

SanDisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

SanDisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

SanDisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

SanDisk’s Penang SSD Platform Technology Development Integration (PTDI) organization is a SSD technology development group that will be embedded in SanDisk’s green-field production facility, SanDisk Storage Malaysia (SDSM) located in the new Batu Kawan Industrial Park, Penang, Malaysia. PTDI is looking for Process Module Engineer (Material/Process) to join a new team tasked with starting up a vertically integrated SSD-focused technology development team with the charter of developing new generations of SSD products for clients, enterprise, and emerging data storage solutions. The vertically integrated manufacturing capability of SDSM represents the most fundamental shift in completing the end-to-end manufacturing value chain for SanDisk’s solid-state NAND data storage products.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
• Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
• Develops new package and SMT process qualification programs.
• Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
• Establishes process control systems, product recipe creation.
• Transfers process to high volume manufacturing and provide support in new factory start-up.
• Acts as a liaison with suppliers/vendors.
• Maintains product quality while developing and introducing package cost reduction programs.
• Coordinates the introduction of new package processes into production.
• Using appropriate tools, performs integrity analysis of packages.

PME Specific Role Description includes the following but not limited to

• SMT material and process development
• SMT AI/ML integration development for machine & product recipe stability predictability
• SMT machine fingerprinting, 5M+E, product/process matching
• SMT technology (material/process/metrology/equipment) pathfinding & roadmap
• Stencil design/development for new components
• DFM assessment and NUDD risk management
• Process-Material-Component-board-drive interactions
• DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
• Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
• Statistical Tools: Statistical analysis (JMP/Minitab), GreenBelt/BlackBelt certification
• Special engineering characterization & improvement projects
• Factory emergency taskforce support

Qualifications

REQUIRED:

• Bachelor/Master in Mechanical/Electrical/Material Science/Engineering required
• 5 years of relevant work experience within semiconductor industry.

PREFERRED:

• Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors to qualify new material in factory.
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing through failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
• Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques)
• Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel
• Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution
• Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition
• Proven success leading technical team(s) in previous work experience

SKILLS

• Track record of AI/ML and machine fingerprinting experience is added advantage.
• Strong verbal and written communications skills

Notice to Candidates

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.