NPI Leadframe & Die Attach Leader

STMicroelectronics; Muar; On-site; MYR 320,000 - 460,000; Full time

Job summary

STMicroelectronics is seeking a seasoned NPI Leadframe/Die Attach Manager in Malaysia to lead new product introductions, process development, and material qualification for leadframe, substrate, and die attach technologies. You'll coordinate with R&D, manufacturing, quality, and suppliers to ensure robust transfer and manufacturing readiness.

You will drive qualification plans, risk mitigation, and continuous improvement while ensuring PFAS-free material qualification and regulatory compliance

Qualifications

• PhD, Master’s, or Bachelor’s degree in Materials Engineering, Electronics, Chemical Engineering, Physics, or a related discipline.
• Minimum 10 years of relevant experience in semiconductor assembly, NPI, leadframe, substrate, or die attach processes.
• Strong technical background in leadframe, substrate, and die attach process development, qualification, or high-volume manufacturing.
• Experience in assembly material qualification, process transfer, and change management.
• Strong knowledge of process characterization, DOE, JMP, SPC, and structured problem-solving tools.
• Familiarity with die attach equipment performance, process capability, and vendor assessment.
• Understanding of assembly design rules, material behavior, and interactions between materials, process, and reliability.
• Experience in PFAS-free or environmentally compliant material qualification is an advantage.
• Strong project management skills with the ability to lead cross-functional and multi-site activities.
• Proven analytical, troubleshooting, and decision-making capabilities.
• Strong communication, negotiation, and stakeholder management skills.
• Ability to work effectively in a multicultural and fast-paced manufacturing environment.
• Fluent in English, both written and spoken.

Responsibilities

• Lead and manage the NPI leadframe, substrate, and die attach process team to support new product introduction and process transfer activities.
• Own the technical execution of leadframe, substrate, and die attach material qualification from concept through release to production.
• Define, evaluate, and challenge assembly design rules, process windows, and technical specifications related to leadframe, substrate, and die attach processes.
• Drive process development, qualification planning, and validation activities for new materials, equipment, and manufacturing methods.
• Assess die attach equipment vendors, technical capabilities, tool performance, and process compatibility for NPI and production scale-up.
• Lead PFAS-free material qualification activities, ensuring compliance with environmental, regulatory, and customer requirements.
• Manage engineering changes related to leadframe, substrate, die attach materials, process parameters, and equipment upgrades.
• Develop and implement qualification plans, process control strategies, and reliability validation requirements for new product and material introductions.
• Perform technical risk assessments, root cause analysis, failure analysis, and corrective action planning for process or material-related issues.
• Collaborate with internal teams and suppliers to resolve technical issues, improve process robustness, and ensure successful product launch.
• Support assembly process optimization with a focus on yield, reliability, throughput, and cost efficiency.
• Ensure process documentation, specifications, SOPs, control plans, and qualification records are complete and compliant.
• Drive cross-functional alignment on project timelines, technical deliverables, and release milestones.
• Support continuous improvement initiatives related to leadframe, substrate, and die attach technologies.

Skills

NPI leadership

Leadframe knowledge

Die attach

Process development

DOE analysis

JMP

Vendor assessment

Cross-functional leadership

Multisite coordination

English fluency

Education

PhD in Materials Eng

MSc in Electronics

BSc in Materials Eng

BSc in Physics

Tools

Die attach equipment

JMP

SPC tools

Job description

STMicroelectronics is seeking a seasoned NPI Leadframe/Die Attach Manager in Malaysia to lead new product introductions, process development, and material qualification for leadframe, substrate, and die attach technologies. You'll coordinate with R&D, manufacturing, quality, and suppliers to ensure robust transfer and manufacturing readiness.

You will drive qualification plans, risk mitigation, and continuous improvement while ensuring PFAS-free material qualification and regulatory compliance