NPI Leadframe / Die Attach Manager

STMicroelectronics; Muar; On-site; MYR 320,000 - 460,000; Full time

Job summary

STMicroelectronics is seeking a seasoned NPI Leadframe/Die Attach Manager in Malaysia to lead new product introductions, process development, and material qualification for leadframe, substrate, and die attach technologies. You'll coordinate with R&D, manufacturing, quality, and suppliers to ensure robust transfer and manufacturing readiness.

You will drive qualification plans, risk mitigation, and continuous improvement while ensuring PFAS-free material qualification and regulatory compliance

Qualifications

• PhD, Master’s, or Bachelor’s degree in Materials Engineering, Electronics, Chemical Engineering, Physics, or a related discipline.
• Minimum 10 years of relevant experience in semiconductor assembly, NPI, leadframe, substrate, or die attach processes.
• Strong technical background in leadframe, substrate, and die attach process development, qualification, or high-volume manufacturing.
• Experience in assembly material qualification, process transfer, and change management.
• Strong knowledge of process characterization, DOE, JMP, SPC, and structured problem-solving tools.
• Familiarity with die attach equipment performance, process capability, and vendor assessment.
• Understanding of assembly design rules, material behavior, and interactions between materials, process, and reliability.
• Experience in PFAS-free or environmentally compliant material qualification is an advantage.
• Strong project management skills with the ability to lead cross-functional and multi-site activities.
• Proven analytical, troubleshooting, and decision-making capabilities.
• Strong communication, negotiation, and stakeholder management skills.
• Ability to work effectively in a multicultural and fast-paced manufacturing environment.
• Fluent in English, both written and spoken.

Responsibilities

• Lead and manage the NPI leadframe, substrate, and die attach process team to support new product introduction and process transfer activities.
• Own the technical execution of leadframe, substrate, and die attach material qualification from concept through release to production.
• Define, evaluate, and challenge assembly design rules, process windows, and technical specifications related to leadframe, substrate, and die attach processes.
• Drive process development, qualification planning, and validation activities for new materials, equipment, and manufacturing methods.
• Assess die attach equipment vendors, technical capabilities, tool performance, and process compatibility for NPI and production scale-up.
• Lead PFAS-free material qualification activities, ensuring compliance with environmental, regulatory, and customer requirements.
• Manage engineering changes related to leadframe, substrate, die attach materials, process parameters, and equipment upgrades.
• Develop and implement qualification plans, process control strategies, and reliability validation requirements for new product and material introductions.
• Perform technical risk assessments, root cause analysis, failure analysis, and corrective action planning for process or material-related issues.
• Collaborate with internal teams and suppliers to resolve technical issues, improve process robustness, and ensure successful product launch.
• Support assembly process optimization with a focus on yield, reliability, throughput, and cost efficiency.
• Ensure process documentation, specifications, SOPs, control plans, and qualification records are complete and compliant.
• Drive cross-functional alignment on project timelines, technical deliverables, and release milestones.
• Support continuous improvement initiatives related to leadframe, substrate, and die attach technologies.

Skills

NPI leadership

Leadframe knowledge

Die attach

Process development

DOE analysis

JMP

Vendor assessment

Cross-functional leadership

Multisite coordination

English fluency

Education

PhD in Materials Eng

MSc in Electronics

BSc in Materials Eng

BSc in Physics

Tools

Die attach equipment

JMP

SPC tools

Job description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

Position Summary

The NPI Leadframe / Die Attach Manager is responsible for leading new product introduction, process development, and material qualification activities for leadframe, substrate, and die attach technologies. This role ensures robust process transfer, technical readiness, and manufacturing stability through close coordination with R&D, manufacturing, quality, supply chain, and equipment vendors. The position also drives process standardization, risk mitigation, and continuous improvement for assembly-related technologies.

YOUR ROLE

• Lead and manage the NPI leadframe, substrate, and die attach process team to support new product introduction and process transfer activities.
• Own the technical execution of leadframe, substrate, and die attach material qualification from concept through release to production.
• Define, evaluate, and challenge assembly design rules, process windows, and technical specifications related to leadframe, substrate, and die attach processes.
• Drive process development, qualification planning, and validation activities for new materials, equipment, and manufacturing methods.
• Assess die attach equipment vendors, technical capabilities, tool performance, and process compatibility for NPI and production scale-up.
• Lead PFAS-free material qualification activities, ensuring compliance with environmental, regulatory, and customer requirements.
• Manage engineering changes related to leadframe, substrate, die attach materials, process parameters, and equipment upgrades.
• Develop and implement qualification plans, process control strategies, and reliability validation requirements for new product and material introductions.
• Perform technical risk assessments, root cause analysis, failure analysis, and corrective action planning for process or material-related issues.
• Collaborate with internal teams and suppliers to resolve technical issues, improve process robustness, and ensure successful product launch.
• Support assembly process optimization with a focus on yield, reliability, throughput, and cost efficiency.
• Ensure process documentation, specifications, SOPs, control plans, and qualification records are complete and compliant.
• Drive cross-functional alignment on project timelines, technical deliverables, and release milestones.
• Support continuous improvement initiatives related to leadframe, substrate, and die attach technologies.

Your Skills & Experiences

• PhD, Master’s, or Bachelor’s degree in Materials Engineering, Electronics, Chemical Engineering, Physics, or a related discipline.
• Minimum 10 years of relevant experience in semiconductor assembly, NPI, leadframe, substrate, or die attach processes.
• Strong technical background in leadframe, substrate, and die attach process development, qualification, or high-volume manufacturing.
• Experience in assembly material qualification, process transfer, and change management.
• Strong knowledge of process characterization, DOE, JMP, SPC, and structured problem-solving tools.
• Familiarity with die attach equipment performance, process capability, and vendor assessment.
• Understanding of assembly design rules, material behavior, and interactions between materials, process, and reliability.
• Experience in PFAS-free or environmentally compliant material qualification is an advantage.
• Strong project management skills with the ability to lead cross-functional and multi-site activities.
• Proven analytical, troubleshooting, and decision-making capabilities.
• Strong communication, negotiation, and stakeholder management skills.
• Ability to work effectively in a multicultural and fast-paced manufacturing environment.
• Fluent in English, both written and spoken.

ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.