Senior Staff Engineer - Die Attach Process Innovation

Infineon Technologies AG; Malacca City; On-site; MYR 180,000 - 280,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks a Senior Staff Engineer to lead Die Attach process development for advanced semiconductor packaging. You will own qualification, industrialization, and process optimization across projects and collaborate with global teams.

You bring 8+ years in semiconductor manufacturing, deep Die Attach expertise, strong DOE and data analytics skills, and a track record delivering manufacturable, cost-effective solutions.

Qualifications

• Minimum 8 years of experience in the semiconductor manufacturing industry.
• Strong exposure to assembly process development and semiconductor packaging technologies.
• Deep knowledge of Die Attach processes, materials, equipment, and process integration.
• Solid understanding of material science, chemical interactions, and process-material relationships.

Responsibilities

• Lead Die Attach process development activities including parameter scouting, optimization, verification, qualification, and process freeze.
• Drive technology transfer from development to manufacturing operations for successful production readiness.
• Support prototype builds, engineering samples, and development projects ensuring process stability and compliance.
• Develop and review process documentation (Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR).
• Provide technical ownership for POR, Assembly Design Rules, Process Roadmaps, and Control Plans.

Skills

Die Attach technologies

Semiconductor packaging

DOE

Statistical analysis

Problem solving

Cross-functional collaboration

Education

Master's or Bachelor's Degree in Engineering, Materials Science, Chemical Engineering, Semiconductor Technology

Job description

Infineon Technologies AG in Malaysia seeks a Senior Staff Engineer to lead Die Attach process development for advanced semiconductor packaging. You will own qualification, industrialization, and process optimization across projects and collaborate with global teams.

You bring 8+ years in semiconductor manufacturing, deep Die Attach expertise, strong DOE and data analytics skills, and a track record delivering manufacturable, cost-effective solutions.