Lead/ Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach)

Lumileds; Bayan Lepas; On-site; MYR 67,000 - 100,000; Full time

Job summary

Lumileds Malaysia is seeking a Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) to own NPI and high-volume production in TFFC. You will lead process development, transfer and CIP projects, ensuring quality, cost control and stability across the assembly line.

Qualified candidates have a Bachelor's degree in Engineering/Science and 3–5 years in Die Attach or related assembly processes, with strong statistical tools and problem-solving skills.

Qualifications

• Bachelor's degree in Engineering/Science is required.
• Strong analytical and problem-solving skills.
• Experience with DoE, quality systems and process control.

Responsibilities

• Sustain stable Assembly process performance.
• Own quality, yield, process capability, cost and CpK metrics.
• Perform DoE-based window studies to optimize cost and quality.
• Develop/optimize processes to improve quality and reliability.
• Establish optimum process and train operations staff.
• Develop equipment/material specs for Dia Attach/Stud Bump; define acceptance criteria.
• Lead process transfer, qualification and ramp-up projects.
• Drive CIP to reduce costs and improve yield and capacity.
• Create documentation and ensure safety/quality compliance.
• Perform risk assessments; own PFMEA and control plans.
• Ensure compliance with environment, health & safety requirements.

Skills

Statistical analysis

8D problem solving

SPC

FMEA

DMAIC

Problem solving

Interpersonal skills

MS Word

Excel

PowerPoint

Education

Bachelor's degree of Engineering / Science

Tools

Microsoft Word

Excel

Project

PowerPoint

Job description

Jora Malaysia will close on 16th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Who We Are:

Lumileds International is a global leader in LED technology, innovation, and solutions for the automotive, display, illumination, mobile, and other markets where light sources are essential. Our approximately 3,300 employees operate in over 15 countries to partner with our customers to deliver solutions for lighting, safety, and well‑being.

The Lumileds environment is fast-paced, cutting-edge, intelligent and fun! We are looking for exceptional talent to join our team! To learn more, visit lumileds.com.

Who You Are:

Position Summary:

Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) responsible for all NPI (New Product Introduction) and Operation (High Volume Production) in TFFC process engineering

What You Will Do:

Responsible for sustaining stable Assembly process performance.

Full process ownership on quality, yield, process capability and stability, cost, CpK and other related KPI.

Perform process window study using standard tools like DoE approach and material / equipment assessment to optimize process in term of cost, and quality.

Responsible for process development / optimization to improve process quality and reliability.

Establish optimum process and provide support to train operations team.

Develop equipment / material specification for Dia Attach/Stud Bump process, including reject and acceptance criteria.

Lead process transfer, process & tool qualification and ramp up related projects.

Lead and drive Continuous Improvement Projects (CIP) to enable cost reduction, capacity expansion, yield and performance enhancement to enable the production of Best-In-Class LED chips at competitive cost.

Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements.

Perform risk assessment and derive necessary control to keep process stable. Owner of PFMEA, control plan and working instruction.

Complies with environment, security, health and safety requirements.

What You Will Bring (RequiredQualifications):

• Bachelor's degree of Engineering / Science.
• Skilled in Statistical analysis tools, 8D problem solving, SPC, FMEA, DMAIC
• Problem solving oriented and Strong analytical mind and interpersonal skills.
• Proficiency with Microsoft Word, Excel, Project and Power Point
• Initiative and able to work under minimum supervision.
• Comfortable working in a fast-paced environment.
• Detail orientated with matured interpersonal and communication skills.

Field of Study

Engineering or any other relevant technical field

Years of Experience (Minimum)

• 3-5 years

Preferred Qualifications:

• Minimum 3 years working experience in Die Attach & Wire Bond assembly process.
• Skilled in Statistical analysis tools, 8D problem solving, SPC, FMEA, DMAIC
• Problem solving oriented and Strong analytical mind and interpersonal skills.

Lumileds is an Equal Employment Opportunity Employer