Lead Process Engineer — LED Assembly & NPI

Lumileds; Bayan Lepas; On-site; MYR 67,000 - 100,000; Full time

Job summary

Lumileds Malaysia is seeking a Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) to own NPI and high-volume production in TFFC. You will lead process development, transfer and CIP projects, ensuring quality, cost control and stability across the assembly line.

Qualified candidates have a Bachelor's degree in Engineering/Science and 3–5 years in Die Attach or related assembly processes, with strong statistical tools and problem-solving skills.

Qualifications

• Bachelor's degree in Engineering/Science is required.
• Strong analytical and problem-solving skills.
• Experience with DoE, quality systems and process control.

Responsibilities

• Sustain stable Assembly process performance.
• Own quality, yield, process capability, cost and CpK metrics.
• Perform DoE-based window studies to optimize cost and quality.
• Develop/optimize processes to improve quality and reliability.
• Establish optimum process and train operations staff.
• Develop equipment/material specs for Dia Attach/Stud Bump; define acceptance criteria.
• Lead process transfer, qualification and ramp-up projects.
• Drive CIP to reduce costs and improve yield and capacity.
• Create documentation and ensure safety/quality compliance.
• Perform risk assessments; own PFMEA and control plans.
• Ensure compliance with environment, health & safety requirements.

Skills

Statistical analysis

8D problem solving

SPC

FMEA

DMAIC

Problem solving

Interpersonal skills

MS Word

Excel

PowerPoint

Education

Bachelor's degree of Engineering / Science

Tools

Microsoft Word

Excel

Project

PowerPoint

Job description

Lumileds Malaysia is seeking a Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) to own NPI and high-volume production in TFFC. You will lead process development, transfer and CIP projects, ensuring quality, cost control and stability across the assembly line.

Qualified candidates have a Bachelor's degree in Engineering/Science and 3–5 years in Die Attach or related assembly processes, with strong statistical tools and problem-solving skills.