Staff Package Design Engineer (High-Speed IC Packages)

Advanced Micro Devices, Inc.; Penang; On-site; MYR 150,000 - 210,000; Full time

Job summary

Advanced Micro Devices, Inc. in Penang, Malaysia is seeking a Senior or Staff Package Design Engineer to own advanced IC package design from concept through production.

You will work with SoC, silicon, signal integrity, power integrity, thermal, and manufacturing teams to meet high-speed interface targets. You will set design methodology, mentor engineers, and drive DFX into the package design process, focusing on LPDDR5X/LPDDR6, PCIe, and die-to-die links to deliver robust, cost-efficient

Qualifications

• 5-10 years of relevant experience in IC or package design, preferably in advanced flip-chip, SiP, PoP, or 2.5D/3D packaging.
• Experience with high-speed interfaces (LPDDR, PCIe, SerDes, HBM, etc.).
• Strong understanding of substrate design flows (Cadence APD/SIP, Allegro).
• Experience in bump/ball map planning, layer stack-up, and design rule management
• Familiarity with manufacturing constraints and materials (BT, ABF, coreless, etc.).
• Excellent problem-solving, communication, and cross-functional collaboration skills.
• Solid knowledge of signal integrity, power integrity fundamentals, and thermal considerations in package design is a plus.
• Experience with analysis tools such as Ansys HFSS/SIwave/Q3D, Cadence Sigrity, or Keysight ADS is a plus.
• Basic scripting ability (SKILL, etc.) for design automation is a plus.

Responsibilities

• Execute package substrate design from concept through production release, including floorplanning, routing, stack-up definition, and design rule validation.
• Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
• Define and implement package architecture based on product electrical, thermal, and mechanical requirements.
• Work with chip, board, and system teams to optimize I/O planning, bump/ball assignments, and interface signal integrity.
• Conduct design feasibility studies and trade-off analysis for performance, cost, and reliability.
• Drive DFX (Design for Manufacturability, Assembly, and Test) into the package design process.
• Perform modelling extraction for signal integrity and power integrity analysis, including high-speed interfaces (DDR/LPDDR, PCIe, SerDes, die-to-die links) and PDN impedance. Close design issues through layout changes and stack-up tuning.
• Collaborate with signal integrity (SI), power integrity (PI), and thermal analysis teams to ensure robust performance across operating conditions.
• Interface with substrate suppliers to define design rules, stack-ups, and material selection.
• Contribute to design automation and flow improvement, scripting, and methodology development for package design efficiency.

Skills

Package design

High-speed interfaces

Substrate design

Design for Manufacturability

Scripting for automation

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field

Tools

Cadence APD/SIP

Allegro

Ansys HFSS

SIwave

Q3D

Cadence Sigrity

Keysight ADS

Job description

Advanced Micro Devices, Inc. in Penang, Malaysia is seeking a Senior or Staff Package Design Engineer to own advanced IC package design from concept through production.

You will work with SoC, silicon, signal integrity, power integrity, thermal, and manufacturing teams to meet high-speed interface targets. You will set design methodology, mentor engineers, and drive DFX into the package design process, focusing on LPDDR5X/LPDDR6, PCIe, and die-to-die links to deliver robust, cost-efficient