IC Package Designer

UST Malaysia; Bayan Lepas; On-site; MYR 60,000 - 100,000; Full time

Job summary

UST Malaysia is seeking an IC Package Designer to develop new IC package designs and update existing designs. Your prime responsibility includes CAD designs, execution planning, 1st level debug for issue isolation and reporting.

The role requires strong experience in high speed PCB design using Mentor Graphics Xpedition VX, GPIO/HSSIO, impedance control, and fabrication drawings, with a 2+ year background in Electrical/Electronics Engineering.

Responsibilities

• Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more).
• Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.
• Perform design self-check based on the design review checklist provided and fix the design accordingly.
• Perform design cleanup with PLA tools and fix issues based on accessibility of PLA tools.
• Full package design including interfaces assignment, power assignment, component placement and constraint setting.
• Use Mentor Graphics Xpedition PCB software to design the substrate in compliance with design rules and electrical requirements.
• Understand interfaces like DDR/PCIe/SERDES etc.
• Maintain knowledge of electrical field theories, electronics fundamentals, and electromagnetic/microwave theory.

Job description

We are looking for IC Package Designer to develop new IC package designs and updating existing designs. Your prime responsibility includes but not limited to: CAD designs, execution planning, 1st level debug for issue isolation and reporting.

Responsibilities

• Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more):
• Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.
• Perform design self-check based on the design review checklist provided and fix the design accordingly.
• Perform design cleanup with PLA tools. (Depend on the accessibility of the PLA tools)
• Full package design including all/partial interfaces assignment as well as power assignment according to schematic that provided. Might include the component placement and constraint setting as well as other package design related request.
• Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements and processes.
• Must understand various interface requirement like DDR/PCIe/SERDES etc.
• Good technical knowledge of electrical field theories, electronic fundamentals, sound knowledge in electromagnetic and microwave theory

Job Requirements:

• Expertise in high speed PCB Design using Mentor Graphics (Xpedition VX), working knowledge in GPIO, HSSIO.
• Expertise in Net, Pin pair and combination-net (Xnets) length matching
• Expertise in CAM setup and Gerber generation
• Accustomed to designing PCB's with a high awareness of “Design for Manufacturing, Assembly, and Test” requirements
• Expertise in Edge-Coupled and Broadside-Coupled Differential pairs and Designed impedance
• Expertise in using Through–Hole, Blind, Buried, Micro & Power vias in PCB.
• Good command on critical signal routing, cross talks, EMI, EMC, Clock signal, Mixed Signal Routings and Power plane distribution.
• Experience in preparation of Fabrication and Assembly Drawings
• Advanced knowledge of constraints and use of the constraint manager
• Experience in documentation like PCB Guidelines, Processes, Checklists and Training materials.
• Bachelor's or Master's degree in Electrical/Electronics Engineering or related field with 2+ years in the related fields.