High-Speed IC Package Designer (Xpedition)

UST Malaysia; Bayan Lepas; On-site; MYR 60,000 - 100,000; Full time

Job summary

UST Malaysia is seeking an IC Package Designer to develop new IC package designs and update existing designs. Your prime responsibility includes CAD designs, execution planning, 1st level debug for issue isolation and reporting.

The role requires strong experience in high speed PCB design using Mentor Graphics Xpedition VX, GPIO/HSSIO, impedance control, and fabrication drawings, with a 2+ year background in Electrical/Electronics Engineering.

Responsibilities

• Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more).
• Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.
• Perform design self-check based on the design review checklist provided and fix the design accordingly.
• Perform design cleanup with PLA tools and fix issues based on accessibility of PLA tools.
• Full package design including interfaces assignment, power assignment, component placement and constraint setting.
• Use Mentor Graphics Xpedition PCB software to design the substrate in compliance with design rules and electrical requirements.
• Understand interfaces like DDR/PCIe/SERDES etc.
• Maintain knowledge of electrical field theories, electronics fundamentals, and electromagnetic/microwave theory.

Job description

UST Malaysia is seeking an IC Package Designer to develop new IC package designs and update existing designs. Your prime responsibility includes CAD designs, execution planning, 1st level debug for issue isolation and reporting.

The role requires strong experience in high speed PCB design using Mentor Graphics Xpedition VX, GPIO/HSSIO, impedance control, and fabrication drawings, with a 2+ year background in Electrical/Electronics Engineering.