IC Package Design Engineer

UST Global (M) Sdn Bhd; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job summary

UST Global (M) Sdn Bhd in Penang seeks an IC Package Designer to develop new package designs and update existing ones. You will perform CAD design, execution planning, and first level debugging to isolate issues.

Responsibilities include high density package layouts, DRC checks, design cleanup, and Mentor Graphics Xpedition work. Familiarity with DDR/PCIe/SERDES interfaces is required.

Qualifications

• Bachelor's or Master's degree in Electrical/Electronics Engineering or related field.
• 2+ years of experience in PCB design or IC packaging related fields.
• Strong knowledge of high-speed PCB design and interface requirements.

Responsibilities

• Execute high density package layout designs across product portfolios.
• Perform DRC checks, fix unconnected pins and dangling vias.
• Self-check designs using review checklists and fix issues.
• Design cleanup with PLA tools and manage interfaces and constraints.
• Use Mentor Graphics Xpedition to design substrates per rules.

Skills

High-speed PCB design

GPIO / HSSIO

Differential pair routing

Signal integrity

Power integrity

Education

Bachelor's or Master's degree in Electrical/Electronics Engineering

Tools

Mentor Graphics Xpedition VX

Job description

We are looking for IC Package Designer to develop new IC package designs and updating existing designs. Your prime responsibility includes but not limited to: CAD designs, execution planning, 1st level debug for issue isolation and reporting.

Responsibilities

Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more):

Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.

Perform design self-check based on the design review checklist provided and fix the design accordingly.

Perform design cleanup with PLA tools. (Depend on the accessibility of the PLA tools)

Full package design including all/partial interfaces assignment as well as power assignment according to schematic that provided. Might include the component placement and constraint setting as well as other package design related request.

Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements and processes.

Must understand various interface requirement like DDR/PCIe/SERDES etc.

Good technical knowledge of electrical field theories, electronic fundamentals, sound knowledge in electromagnetic and microwave theory

Job Requirements:

Expertise in high speed PCB Design using Mentor Graphics (Xpedition VX), working knowledge in GPIO, HSSIO.

Expertise in Net, Pin pair and combination-net (Xnets) length matching

Expertise in CAM setup and Gerber generation

Accustomed to designing PCB's with a high awareness of “Design for Manufacturing, Assembly, and Test” requirements

Expertise in Edge-Coupled and Broadside-Coupled Differential pairs and Designed impedance

Expertise in using Through–Hole, Blind, Buried, Micro & Power vias in PCB.

Good command on critical signal routing, cross talks, EMI, EMC, Clock signal, Mixed Signal Routings and Power plane distribution.

Experience in preparation of Fabrication and Assembly Drawings

Advanced knowledge of constraints and use of the constraint manager

Experience in documentation like PCB Guidelines, Processes, Checklists and Training materials.

Bachelor's or Master's degree in Electrical/Electronics Engineering or related field with 2+ years in the related fields.