Package Architect

Altera Corporation; Malaysia; On-site; MYR 180,000 - 300,000; Full time

Job summary

Altera Corporation in Penang, Malaysia seeks a senior packaging engineer to translate product requirements into package architecture and drive end-to-end packaging solutions. The role ensures alignment with electrical, mechanical, thermal, and reliability standards while collaborating with silicon, hardware, and package leads.

Ideal candidates have 15+ years in packaging or board design, with hands-on experience in Mentor Graphics, Cadence, or AutoCAD and a track record of cost-effective,

Qualifications

• 15+ years of related experience.
• BS/MS in EE/ME/CE/CS or related fields.
• Experience with packaging or board design development.
• Experience with automated design flows and tracking design efficiency metrics.

Responsibilities

• Translate product requirements into package architecture specifications.
• Lead end-to-end package development, including design, processes and procedures.
• Collaborate with manufacturing to ensure tape-out transitions to production.

Skills

Package design

Design automation

Design metrics tracking

Education

BS/MS in EE/ME/CE/CS or related fields

Tools

Mentor Graphics

Cadence

AutoCAD

Job description

Job Details

Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology trade-off decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones. Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks. Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets. Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions. Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications

What We Want to See

• We are seeking someone with 15+ years of experience and a BS/MS in EE, ME, CE, CS or related fields with experience in one or more of the following: Packaging or Board design development and equivalent package design tools Lead substrate and package design and development projects Ways to Stand Out from the Crowd Experience in developing & automated design flows and tracking design efficiency metrics Experience in Semiconductor Packaging Substrate technology design and development Experience in Package design tools such as Mentor Graphics, Cadence and/or Auto CAD

Job Type

Regular Shift: Shift 1 (Malaysia)

Location

Primary Location: Penang 15, Penang, Malaysia

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

About Altera

Altera: Accelerating Innovators Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet.