IC Package Design Engineer - High-Speed PCB (Xpedition)

UST Global (M) Sdn Bhd; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job summary

UST Global (M) Sdn Bhd in Penang seeks an IC Package Designer to develop new package designs and update existing ones. You will perform CAD design, execution planning, and first level debugging to isolate issues.

Responsibilities include high density package layouts, DRC checks, design cleanup, and Mentor Graphics Xpedition work. Familiarity with DDR/PCIe/SERDES interfaces is required.

Qualifications

• Bachelor's or Master's degree in Electrical/Electronics Engineering or related field.
• 2+ years of experience in PCB design or IC packaging related fields.
• Strong knowledge of high-speed PCB design and interface requirements.

Responsibilities

• Execute high density package layout designs across product portfolios.
• Perform DRC checks, fix unconnected pins and dangling vias.
• Self-check designs using review checklists and fix issues.
• Design cleanup with PLA tools and manage interfaces and constraints.
• Use Mentor Graphics Xpedition to design substrates per rules.

Skills

High-speed PCB design

GPIO / HSSIO

Differential pair routing

Signal integrity

Power integrity

Education

Bachelor's or Master's degree in Electrical/Electronics Engineering

Tools

Mentor Graphics Xpedition VX

Job description

UST Global (M) Sdn Bhd in Penang seeks an IC Package Designer to develop new package designs and update existing ones. You will perform CAD design, execution planning, and first level debugging to isolate issues.

Responsibilities include high density package layouts, DRC checks, design cleanup, and Mentor Graphics Xpedition work. Familiarity with DDR/PCIe/SERDES interfaces is required.