Package Architect

754 Altera Semiconductor Technology (M) Sdn. Bhd.

George Town

On-site

MYR 300,000 - 540,000

Full time

14 days+

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Job summary

754 Altera Semiconductor Technology (M) Sdn. Bhd. in Penang seeks a senior packaging engineer to drive end-to-end package solutions, translate product requirements into packaging architecture, and ensure conformance to electrical, mechanical, thermal, and reliability standards.

You will collaborate with silicon, hardware, and package leads, overseeing design, processes, and tape-out transitions to production, and help improve packaging quality and cost efficiency through innovative solutions.

Qualifications

  • 15+ years of experience in packaging or board design development.
  • Experience with packaging design tools such as Mentor Graphics, Cadence and/or AutoCAD.
  • Experience in substrate technology design and development.
  • Experience in automated design flows and tracking design efficiency metrics.

Responsibilities

  • Translate product requirements into packaging architecture and drive end-to-end package solutions.
  • Lead technology trade-off decisions ensuring conformance to electrical, mechanical, thermal and reliability standards.
  • Collaborate with silicon, hardware and package leads to ensure high quality packaging output.
  • Oversee end-to-end packaging development, including design, processes and tape-out transitions to production.

Skills

Semiconductor packaging
Package design
Design flow automation
Substrate technology
Package design tools (Mentor, Cadence,

Education

BS/MS in EE/ME/CE/CS

Tools

Mentor Graphics
Cadence
AutoCAD

Job description

Job Details

Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology trade-off decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones. Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks. Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets. Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions. Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications

What We Want to See

  • We are seeking someone with 15+ years of experience and a BS/MS in EE, ME, CE, CS or related fields with experience in one or more of the following: Packaging or Board design development and equivalent package design tools Lead substrate and package design and development projects Ways to Stand Out from the Crowd Experience in developing & automated design flows and tracking design efficiency metrics Experience in Semiconductor Packaging Substrate technology design and development Experience in Package design tools such as Mentor Graphics, Cadence and/or Auto CAD
Job Type

Regular Shift: Shift 1 (Malaysia)

Location

Primary Location: Penang 15, Penang, Malaysia

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

About Altera

Altera: Accelerating Innovators Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet.

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