Head of R&D: Wide-Bandgap Power Packaging

Carsem (M) Sdn. Bhd.; Ipoh; On-site; MYR 350,000 - 600,000; Full time

Job summary

Carsem (M) Sdn. Bhd. seeks a Head of Research & Development to steer the technology agenda for our Wide-Bandgap business, defining the innovation roadmap and leading the R&D team.

You will own the pilot line, drive industrialization of advanced interconnects, and partner with customers on new materials and processes. The role requires senior leadership in semiconductor packaging, hands-on SiC/GaN experience, and a track record of moving packages from concept through mass production.

Qualifications

• Senior R&D or technology leadership in semiconductor packaging.
• Hands-on leadership in wide-bandgap (SiC/GaN) power device packaging.
• Deep knowledge of assembly and test processes, materials, and high-power reliability.

Responsibilities

• Define and drive R&D and technology roadmap for wide-bandgap power packaging.
• Lead development and industrialization of interconnect and assembly technologies.
• Pilot line ownership, modeling, simulation, and continuous improvement.
• Serve as senior technical partner to customers on new product, material and process development.
• Lead cost reduction without compromising reliability.
• Own IP strategy across Carsem's M-site and S-site.
• Build and mentor a multidisciplinary R&D organization.

Skills

R&D Leadership

Power Packaging

SiC GaN

Team Mentoring

Project Management

Lean Manufacturing

IP Strategy

Education

Bachelor's Degree in Electrical & Electronic Engineering

Postgraduate qualification

Tools

Reliability Testing

Materials Characterization

Project Planning Tools

Job description

Carsem (M) Sdn. Bhd. seeks a Head of Research & Development to steer the technology agenda for our Wide-Bandgap business, defining the innovation roadmap and leading the R&D team.

You will own the pilot line, drive industrialization of advanced interconnects, and partner with customers on new materials and processes. The role requires senior leadership in semiconductor packaging, hands-on SiC/GaN experience, and a track record of moving packages from concept through mass production.