Failure Analysis Engineer

Season Malaysia Manufacturing Sdn Bhd; Seberang Perai; On-site; MYR 78,000 - 100,000; Full time

Job summary

Season Malaysia Manufacturing Sdn Bhd is seeking an experienced Failure Analysis Engineer to perform root cause analysis and repair of electronic assemblies in an EMS manufacturing environment.

You will troubleshoot at board and component level, operate BGA rework and test equipment, and collaborate across Process, Quality, and Supplier teams to drive quality improvements.

Qualifications

• Diploma/Degree in Electronic/Electrical Engineering or Mechatronics with EMS exposure.
• Hands-on experience in failure analysis, repair, or electronic repair.
• IPC certification is an added advantage.

Responsibilities

• Perform failure analysis on production rejects, customer returns, and reliability test failures.
• Troubleshoot electronic assemblies down to board and component level using schematics, test equipment, and diagnostic tools.
• Repair defective PCB assemblies and products through component replacement and rework activities.
• Operate soldering stations, hot air rework stations, BGA rework systems, microscopes, and related FA equipment.
• Perform BGA removal, reballing, replacement, and verification of solder joint integrity.
• Conduct root cause analysis (RCA) using methodologies such as 8D, 5 Why, Fishbone Diagram, and FMEA.
• Analyze failures related to SMT, PCB assembly, soldering defects, components, and manufacturing processes.
• Generate detailed failure analysis and repair reports with findings and corrective action recommendations.
• Work closely with Process, Manufacturing, Quality, Test, and Supplier teams to resolve failures.
• Support yield improvement, cost reduction, and continuous quality improvement projects.
• Maintain FA laboratory equipment and ensure compliance with ESD, safety, and quality requirements.

Skills

Troubleshooting

Root cause analysis

8D 5 Why Fishbone FMEA

Schematic interpretation

Team collaboration

Education

Diploma/Degree in Electronic/Electrical Engineering

Mechatronics

Tools

Soldering stations

Oscilloscopes

Multimeters

BGA rework equipment

Microscopes

Job description

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Responsible for conducting failure analysis, troubleshooting, repair, and rework activities on electronic products and assemblies to identify root causes, restore product functionality, implement corrective actions, and improve product reliability and manufacturing quality.

Responsibilities

Perform failure analysis on production rejects, customer returns, and reliability test failures.

Troubleshoot electronic assemblies down to board and component level using schematics, test equipment, and diagnostic tools.

Repair defective PCB assemblies and products through component replacement and rework activities.

Operate soldering stations, hot air rework stations, BGA rework systems, microscopes, and related FA equipment.

Perform BGA removal, reballing, replacement, and verification of solder joint integrity.

Conduct root cause analysis (RCA) using methodologies such as 8D, 5 Why, Fishbone Diagram, and FMEA.

Analyze failures related to SMT, PCB assembly, soldering defects, components, and manufacturing processes.

Generate detailed failure analysis and repair reports with findings and corrective action recommendations.

Work closely with Process, Manufacturing, Quality, Test, and Supplier teams to resolve failures.

Support yield improvement, cost reduction, and continuous quality improvement projects.

Maintain FA laboratory equipment and ensure compliance with ESD, safety, and quality requirements.

Scope of Authority

Authorized to determine failure root cause, recommend repair disposition, and initiate corrective actions for product and process quality issues within assigned responsibilities.

Requirements

Diploma/Degree in Electronic Engineering, Electrical Engineering, Mechatronics, or related engineering discipline, with experience in EMS manufacturing, failure analysis, or electronic repair.

Strong troubleshooting and analytical skills with the ability to perform board-level diagnosis, component-level repair, root cause analysis, and interpretation of circuit schematics.

Hands-on experience using soldering stations, hot air rework stations, BGA rework stations, microscopes, oscilloscopes, multimeters, and other electronic test and repair equipment. IPC certification is an added advantage.