Failure Analysis Technician / Senior

Tecan CDMO Solutions PN Sdn. Bhd.

Seberang Perai

On-site

MYR 42,000 - 63,000

Full time

3 days ago
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Job summary

Tecan CDMO Solutions PN Sdn. Bhd. in Malaysia is hiring a FA Technician to diagnose, troubleshoot and repair PCBA components and complete system sets, ensuring functionality within Manufacturing Lead Time.

You will perform functional analysis, disassemble/reassemble units, execute high-precision soldering, and verify performance before returning units to production or customers. Fluency in English and Bahasa Malaysia is required.

Qualifications

  • Certificate or Diploma in Electrical, Electronics, or Mechatronics Engineering.
  • IPC-A-610 / IPC-7711/21 Certified or basic soldering training.
  • 1–2 years electronics repair experience in board and system/box-build.

Responsibilities

  • System & PCBA analysis to identify failures at board and unit level.
  • Disassemble and reassemble finished units to access components.
  • Perform high-precision soldering for PCBA repairs.
  • Conduct functional verification to meet specifications.
  • Provide findings to FA Engineer for batch issues or new defects.
  • Assist during NPI by testing complete units for design issues.
  • Record repair logs in Defect Tracker/Excel for KPI reporting.
  • Maintain 5S and strict ESD and safety in FA area.
  • Ensure Manufacturing Lead Time (MLT) compliance for all units.

Skills

Troubleshooting
Soldering
Oscilloscopes
Multimeters
Schematics reading
Disassembly
Reassembly
PCB analysis
English language
Bahasa Malaysia

Education

Certificate or Diploma in Electrical, Electronics, or Mechatronics Engineering
IPC-A-610 / IPC-7711/21 Certified

Tools

Multimeters
Oscilloscopes
Hand tools

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.


The FA Technician is responsible for hands-on troubleshooting, analysis, and repair of bothPCBA components and complete system sets. The role involves diagnosing failures at the unit level, identifying root causes through physical testing, and ensuring all units (individual boards or finished products) are restored to full functionality within the Manufacturing Lead Time (MLT).


System & PCBA Analysis:Perform functional analysis oncomplete setsto identify system-level failures (e.g., wiring, connectivity, or mechanical issues) as well as board-level component defects using multimeters and oscilloscopes.


Assembly & Disassembly:Carefully disassemble finished units to access internal components for analysis and perform professional re-assembly of thecomplete setfollowing repair.


Repair Execution:Conduct high-precision soldering for PCBA repairs and perform mechanical adjustments or part replacements for complete unit sets.


Functional Verification:Conduct final testing on thecomplete setafter repair to ensure the unit meets all operational specifications before being returned to production or the customer.


Feedback & Escalation:Immediately provide findings to theFA Engineerif a failure pattern is detected in a specific batch of complete sets or if a new system-level defect is discovered.


NPI Support:Assist during the New Product Introduction (NPI) phase by testing complete units to detect early assembly or design integration issues.


Data Entry:Record detailed repair logs (symptoms, root cause, and parts replaced) for both boards and complete sets in theDefect Tracker/Excelto support KPI reporting.


MLT Compliance:Maintain a high efficiency rate to ensure theManufacturing Lead Time (MLT)is met for all assigned units and system sets.


Workplace Standards:Ensure the FA area is 5S compliant and that all repairs on complete units are performed under strict ESD and safety guidelines.


Basic Education


Certificate or Diploma in Electrical, Electronics, or Mechatronics Engineering.


Further Education


Basic Soldering and Mechanical Assembly training or IPC-A-610 / IPC-7711/21 Certified.


Experience


1 - 2 years of experience in electronics repair (both board and system/box-build level).


Experience in a \"Box-Build\" or Final Assembly environment.


Language Skills


Fluent in English and Bahasa Malaysia (written and spoken).


Technical Knowledge and Skills


Proficient withMultimeters, Oscilloscopes,and hand tools.


Ability to read Schematics and Assembly Drawings.


Skilled inDisassembly/Re-assemblyof electronic products.


Physical Requirements


Shift:12-hour rotating shifts (Day/Night) and weekend overtime.


High manual dexterity: Ability to handle both small components and larger unit assemblies.


ESD:Full ESD attire compliance (smock, wrist strap, and shoes).


Core:Attention to detail (especially for complete sets), Discipline, Teamwork.

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