Equipment Engineer

CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD.; Batu Kawan; On-site; MYR 89,000 - 134,000; Full time

Job summary

Chipbond Technology Malaysia Sdn. Bhd. is hiring an Equipment Engineer in Penang to install, configure, and commission new equipment and systems.

You will perform preventive and corrective maintenance to minimize downtime and work with cross-functional teams to optimize performance. We value a Bachelor's degree in Electrical/Electronic Engineering and at least 2 years in semiconductor environments, with proficiency in Mandarin and English for communication with Taiwan HQ and Mandarin-speaking

Qualifications

• Bachelor's degree in Electrical/Electronic Engineering or related field.
• At least 2 years as Equipment Engineer in a semiconductor environment.
• Experience with sputter (PVD/PECVD), Wafer Sort/Prober, wafer sawing, tapping, grinding, laser marking/grooving, pick-and-place, tape and reel.
• Proficiency in Mandarin and English for coordination with Taiwan HQ and Chinese clients.

Responsibilities

• Install, configure, and commission new equipment and systems.
• Perform preventive and corrective maintenance on production equipment.
• Diagnose and troubleshoot equipment issues to minimize downtime.
• Collaborate with cross-functional teams to optimize equipment performance.
• Develop and implement equipment improvement plans.
• Maintain detailed records and documentation of equipment maintenance and repairs.
• Provide technical support and training to production staff on equipment operation.

Skills

Mandarin

English

Education

Bachelor's degree in Electrical/Electronic Engineering or related field

Job description

Install, configure, and commission new equipment and systems

Perform preventive and corrective maintenance on production equipment

Diagnose and troubleshoot equipment issues to minimize downtime

Collaborate with cross-functional teams to optimize equipment performance

Develop and implement equipment improvement plans

Maintain detailed records and documentation of equipment maintenance and repairs

Provide technical support and training to production staff on equipment operation

What we're looking for

Bachelor's degree in electrical/Electronic Engineering or a related technical field.

At least 2 years of experience working as an Equipment Engineer in semiconductor environment; Experienced in managing machine related: sputter (PVD/PECVD) / Wafer Sort / Wafer Prober / wafer sawing / taping / grinding / Laser marking/ Laser grooving/ Pick and Place/ Tape and Reel

The above positions require proficiency in Mandarin, English, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.

Fresh Graduate is encouraged to apply as well.

• What's your expected monthly basic salary?
• Which of the following languages are you fluent in?
• How much notice are you required to give your current employer?
• Are you willing to travel for this role when required?
• Are you available for shift work?

Consumer Electronics Manufacturing 101-1,000 employees

Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park

We have expanded the operations to 6 locations with approximately 5,200 people

We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.

We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!

Consumer Electronics Manufacturing 101-1,000 employees

Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park

We have expanded the operations to 6 locations with approximately 5,200 people

We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.

We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!

Consumer Electronics Manufacturing 101-1,000 employees

Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park

We have expanded the operations to 6 locations with approximately 5,200 people

We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.

We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!