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Chipbond Technology Malaysia Sdn. Bhd. in Penang is seeking a Quality Engineer to handle customer quality issues, implement requirements, and support ongoing audits and reporting.
You will coordinate with customers and Taiwan HQ in Mandarin and English to ensure clear communication and timely actions. Responsibilities include leading audits, performing failure analysis on parts and rejects, planning improvements to analysis capability, and maintaining ISO 9001, IATF 16949, IECQ QC080000
Handle customer quality issues, implement customer quality requirements.
Lead customer audits, meetings, and quality reports.
Perform failure analysis on parts complained by customer and in house rejects.
Plan and improve failure analysis capability and capacity continuously
Quality Management System: Establish and maintain quality systems to fulfill customer requirements and hold international certifications (ISO 9001, IATF 16949, IECQ QC080000).
Manufacturing Quality Supervision: Implement and manage Statistical Process Control (SPC), monitor production environment, conduct process audits, maintain Measurement System Analysis (MSA), and manage engineering changes.
1. Bachelor's degree in chemistry engineering or any relevant field, Fresh Graduate is encouraged to apply as well.
2. The above positions require proficiency in Mandarin, English. Mandarin proficiency is highly preferred, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin- speaking clients.
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park
We have expanded the operations to 6 locations with approximately 5,200 people
We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.
We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park
We have expanded the operations to 6 locations with approximately 5,200 people
We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.
We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!