Equipment Engineer - Optimize & Maintain Semiconductor Tools

CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD.

Batu Kawan

On-site

MYR 89,000 - 134,000

Full time

14 days+

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Job summary

Chipbond Technology Malaysia Sdn. Bhd. is hiring an Equipment Engineer in Penang to install, configure, and commission new equipment and systems.

You will perform preventive and corrective maintenance to minimize downtime and work with cross-functional teams to optimize performance. We value a Bachelor's degree in Electrical/Electronic Engineering and at least 2 years in semiconductor environments, with proficiency in Mandarin and English for communication with Taiwan HQ and Mandarin-speaking

Qualifications

Bachelor's degree in Electrical/Electronic Engineering or related field.
At least 2 years as Equipment Engineer in a semiconductor environment.
Experience with sputter (PVD/PECVD), Wafer Sort/Prober, wafer sawing, tapping, grinding, laser marking/grooving, pick-and-place, tape and reel.
Proficiency in Mandarin and English for coordination with Taiwan HQ and Chinese clients.

Responsibilities

Install, configure, and commission new equipment and systems.
Perform preventive and corrective maintenance on production equipment.
Diagnose and troubleshoot equipment issues to minimize downtime.
Collaborate with cross-functional teams to optimize equipment performance.
Develop and implement equipment improvement plans.
Maintain detailed records and documentation of equipment maintenance and repairs.
Provide technical support and training to production staff on equipment operation.