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LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. in Johor seeks an experienced Lead Electrical Failure Analysis engineer to drive root-cause investigations for SiP modules and related products.
You will independently analyze complex failures from R&D pilot builds, mass production, reliability tests and returns. You will work with the PFA team on SEM and FIB analyses, correlate findings with design and packaging, and push corrective actions to improve yield and reliability.
LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. View all jobs
Lead electrical failure analysis for System-in-Package (SiP), wireless and power module products. Manage failure-analysis cases arising from R&D pilot builds, mass-production yield excursions, reliability testing and customer returns. Independently perform failure localization, root-cause analysis, corrective-action verification, FA reporting and case closure.
Operate EFA equipment, including oscilloscopes, EMMI, OBIRCH, TDR and I-V/C-V measurement systems
Diagnose SiP-related failures such as open/short circuits, leakage current, functional failures, intermittent faults, solder-joint defects and interconnection failures
Collaborate with the Physical Failure Analysis (PFA) team on SEM, FIB and cross-section analysis
Correlate electrical and physical findings to identify root causes involving product design, component materials, packaging processes and test methods
Drive yield improvement by analysing failure patterns, proposing practical corrective actions and working with Process, PIE, Test and R&D teams
Develop and optimise EFA methodologies, standard operating procedures and failure-case databases
Support customer FA audits, quality reviews, technical discussions and troubleshooting enquiries
Contribute to laboratory efficiency, technical capability development, product reliability validation and quality improvement
Bachelor's degree or above in Microelectronics, Electronic Engineering, Semiconductor Technology, Materials Science, Automation or a related field
Minimum three years of hands-on EFA experience within semiconductor packaging and testing, SiP modules or a related industry
Strong understanding of SiP packaging processes, module construction, basic IC circuitry, FT/WAT testing and common failure mechanisms
Proven ability to independently investigate and close complex failure cases using appropriate EFA techniques
Familiarity with PFA methods and the ability to combine EFA and PFA findings for accurate root-cause determination
Experience in mass-production yield improvement and systematic investigation of batch-related failures
Strong analytical, problem-solving and cross-functional coordination skills
Able to prepare professional FA reports in both English and Chinese
Confident in supporting customer technical reviews and communicating complex findings clearly