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NXP Semiconductors Malaysia is seeking a dedicated Failure Analysis specialist to perform extensive sample preparation and imaging for package-level EFA and die-level PFA. The role requires hands-on FA execution, documentation, and collaboration with fab teams.
Operate RIE, MIP, X-Prep, cross-sectioning, and other FA tools, document results, and contribute to the development of new FA techniques and recipes. A related degree with 3+ years in semiconductor environments is preferred.
NXP Semiconductors Malaysia is seeking a dedicated Failure Analysis specialist to perform extensive sample preparation and imaging for package-level EFA and die-level PFA. The role requires hands-on FA execution, documentation, and collaboration with fab teams.
Operate RIE, MIP, X-Prep, cross-sectioning, and other FA tools, document results, and contribute to the development of new FA techniques and recipes. A related degree with 3+ years in semiconductor environments is preferred.