Senior FA Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 60,000 - 90,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking a dedicated Failure Analysis specialist to perform extensive sample preparation and imaging for package-level EFA and die-level PFA. The role requires hands-on FA execution, documentation, and collaboration with fab teams.

Operate RIE, MIP, X-Prep, cross-sectioning, and other FA tools, document results, and contribute to the development of new FA techniques and recipes. A related degree with 3+ years in semiconductor environments is preferred.

Qualifications

• Bachelor's or Master's degree in Materials Science, Physics, Analytical Chemistry, or related field.
• 3+ years experience in semiconductor manufacturing or R&D; wafer fab experience a plus.
• Hands-on experience with FA sample preparation tools and techniques.
• Strong knowledge of semiconductor device processing and packaging technologies.

Responsibilities

• Perform comprehensive FA sample preparation and imaging using multiple techniques.
• Operate precision milling/polishing and RIE systems for site-specific FA.
• Perform die extraction and layer-by-layer die polishing.
• Document observations, conclusions, and recommended corrective actions.
• Contribute to development of new FA techniques and tool evaluations.
• Demonstrate a strong understanding of semiconductor manufacturing processes.
• Collaborate with cross-functional teams in a wafer fab environment.

Skills

FA sample prep tools

Semiconductor knowledge

Die extraction

Education

Bachelor's or Master's in Materials Science/Physics/Analytical Chemistry

Tools

RIE

MIP

SEM/EDX

Job description

• Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
• Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
• Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
• Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.
• Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.
• Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies;
• Demonstrate a strong understanding of semiconductor manufacturing processes.

• Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
• Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
• Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
• Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.
• Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.
• Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies;
• Demonstrate a strong understanding of semiconductor manufacturing processes.

Job Qualifications

• Bachelor's or Master's degree in Materials Science, Physics, Analytical Chemistry, or a related field.
• Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus.
• Hands-on experience with a broad range of FA sample preparation tools and techniques.
• Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.

More information about NXP in Malaysia...