Senior Staff Engineer Failure Analysis

Infineon Technologies; Kulim; On-site; MYR 90,000 - 130,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a technically skilled FA engineer to guide EFA activities. You will perform complex IC FA including electrical verification and fault isolation on package and wafer samples, and lead microscopy inspection for clear visualization of defects.

CAD navigation and cross-functional communication are essential to locate root causes. The role requires advanced degrees in electrical engineering and expertise in semiconductor processing, with a focus on reliability

Qualifications

• Degree/Master/PhD in Electrical and Electronic Engineering.
• Expertise in advanced electrical failure verification and localization.
• Experience with bench testing, IV curves, and functional verification.
• Skill in microscopy and defect visualization for package/wafer levels.
• Familiarity with COB repackaging and CAD navigation.

Responsibilities

• Provide technical guidance to FA personnel on EFA.
• Perform complex IC FA including electrical verification and fault isolation.
• Localize parametric and functional failures at package and wafer level.
• Navigate CAD, analyze layouts and schematics to locate failures.
• Lead sample prep and microscopy inspection for defects.
• Prepare FA reports and lead cross-functional discussions.
• Drive FA interfacing with test, product, and process engineers.
• Identify development opportunities to improve FA techniques.
• Drive FA to achieve KPIs.

Skills

Electrical failure verification

Localization techniques

Electrical micro-probing

OBIRCH localization

TIVA localization

SEI localization

Advanced sample preparation

Imaging: optical/SEM/FIB

COB packaging

CAD navigation

Semiconductor processing

Education

Electrical and Electronic Engineering degree (BEng/MEng/PhD)

Job description

Your Role

• Provide technical guidance in multiple Fields of Knowledge to FA personnel pertaining to EFA.
• Perform up to complex level of IC FA including electrical verification and fault isolation on package and wafer samples.
• Complex localization of parametric and functional failure (bench verification + EFL technique).
• CAD navigation, layout and schematic analysis to identify the failure location and hypothesis.
• Perform or lead sample preparation and microscopy inspection for clear visualization of package and wafer level defects.
• Prepare FA reports that can lead to root cause finding and corrective action. Lead FA results discussion in cross functional meetings, projects, urgent and important meetings.
• Drive FA interfacing with test, product, process integration and unit process engineers for effective analysis support.
• Identify development opportunity of new EFA techniques and improvise FA skills and techniques to enhance analysis quality, speed and cost.
• Drive FA for achieving EFA KPIs.

Qualifications and Skills

Qualification: Degree / Master / PhD in Electrical and Electronic Engineering Technical Skills:

• Advanced electrical failure verification and localization, i.e. bench testing for IV curve & functional verification, die front/back-side localization, electrical micro-probing with passive & active probe, OBIRCH/TIVA/SEI localizations.
• Advanced sample preparation, i.e. wet/dry chemical, backside preparation, package preparation.
• Imaging for defect visualization, i.e. optical, SEM and FIB (incl. Voltage Contrast).
• Repackaging skill i.e. Chip On Board (COB).
• CAD Navigation System.
• Semiconductor processing, fabrication, device and testing knowledges.