Mid End Process Manager

Nexperia; Seremban; On-site; MYR 240,000 - 360,000; Full time

Job summary

Nexperia is seeking a Wire Bond Process Manager to lead sustaining engineering across Wire Bond, Molding, Plating, Singulation, and Trim & Form in a semiconductor assembly environment.

You will drive process stability, yield improvement, and cost-efficient manufacturing while mentoring engineers and coordinating with Production, Quality, Maintenance, and customers.

Qualifications

• Strong technical expertise in Wire Bond, Molding, Plating, Singulation and Trim & Form semiconductor processes.
• Proven track record of yields improvement and defect reduction in semiconductor manufacturing.
• Experience with 8D, 5 Why, FMEA, DOE, SPC and Root Cause Analysis.
• Experience leading process engineering and technician teams.
• Experience managing package qualifications, technology transfers and NPI.
• Stakeholder collaboration with Production, Quality, Maintenance, Equipment and Product Engineering.
• Ability to drive KPIs such as Yield, Scrap Reduction, Cost Improvement and Productivity.

Responsibilities

• Lead and develop sustaining engineering teams across Wire Bond, Molding, Plating, Singulation, and Trim & Form.
• Drive process stability, robustness, and continuous improvement across manufacturing areas.
• Lead yield improvement and defect reduction initiatives using structured problem-solving.
• Resolve complex manufacturing issues through Root Cause Analysis, 8D, 5 Why, FMEA, DOE, and statistical tools.
• Manage process qualifications, technology transfers, package conversions, and NPI activities.
• Collaborate with Production, Quality, Equipment Engineering, Maintenance, Product Engineering, and customers to address challenges.
• Establish and monitor key process metrics to meet factory goals and targets.
• Drive cost reduction, productivity improvement, equipment utilization, and cycle time optimization.
• Provide technical guidance, coaching, and career development to engineers and technicians.
• Support customer audits, reliability investigations, and quality programs.

Skills

Wire Bond

Molding

Plating

Singulation

Trim & Form

Yield Improvement

Defect Reduction

Problem Solving

Root Cause Analysis

NPI

Technology Transfer

Package Qualifications

Collaboration

KPIs

Stakeholder Management

Leadership

Communication

Lean Six Sigma

TPM Knowledge

Education

Bachelor's degree in Mechanical

Bachelor's degree in Electrical

Bachelor's degree in Mechatronics

Equivalent

Job description

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Wire Bond Process Manager

Job Summary

This role is responsible for leading and managing sustaining engineering activities across Wire Bond, Molding, Plating, Singulation, and Trim & Form processes within a semiconductor assembly manufacturing environment.

What You Need to Do

• Lead and develop sustaining engineering teams supporting Wire Bond, Molding, Plating, Singulation, and Trim & Form processes.
• Drive process stability, robustness, and continuous improvement across all assigned manufacturing areas.
• Lead yield improvement and defect reduction initiatives using structured problem-solving methodologies.
• Resolve complex manufacturing issues through Root Cause Analysis, 8D, 5 Why, FMEA, DOE, and statistical analysis tools.
• Manage process qualifications, technology transfers, package conversions, and New Product Introduction (NPI) activities.
• Collaborate with Production, Quality, Equipment Engineering, Maintenance, Product Engineering, and customers to address technical challenges and improve manufacturing performance.
• Establish and monitor key process metrics to ensure achievement of factory goals and targets.
• Drive cost reduction, productivity improvement, equipment utilization, and cycle time optimization initiatives.
• Provide technical guidance, coaching, and career development to engineers and technicians.
• Support customer audits, reliability investigations, and quality improvement programs.

What You Need to Have

• Strong technical expertise in Wire Bond, Molding, Plating, Singulation, and Trim & Form semiconductor processes.
• Proven track record in yield improvement and defect reduction within a semiconductor manufacturing environment.
• Strong problem-solving skills using 8D, 5 Why, FMEA, DOE, SPC, and Root Cause Analysis methodologies.
• Experience leading and developing process engineering and technician teams.
• Experience managing new package qualifications, technology transfer projects, and NPI activities.
• Strong collaboration with Production, Quality, Maintenance, Equipment Engineering, Product Engineering, and Customers.
• Results-oriented leader capable of driving factory KPIs including Yield, Scrap Reduction, Cost Improvement, Productivity, and Customer Satisfaction.
• Strong stakeholder management, leadership, and communication skills.
• Bachelor's degree in Mechanical, Electrical, Mechatronics or equivalent.
• 10+ years semiconductor equipment experience.
• 5+ years leadership experience.
• Lean Six Sigma and TPM knowledge.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.