Engineer III (Diebond)

Nexperia; Seremban; On-site; MYR 90,000 - 150,000; Full time

Job summary

Nexperia is seeking a Development Die Bond Engineer to develop, qualify, and industrialize new die attach technologies for semiconductor packaging. You will drive innovations from concept to high-volume manufacturing, collaborating with R&D, Product Development, Process Engineering, Quality, and Operations to deliver robust, cost-effective die bond solutions.

You will lead process development for new packages, run DOE experiments, evaluate new equipment, and support tech transfers to mass

Qualifications

• Bachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.
• 2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.

Responsibilities

• Develop and qualify new die bond processes, materials, and assembly technologies.
• Lead process development activities for new semiconductor packages and products.
• Design and execute experiments (DOE) to optimize process performance and reliability.
• Evaluate and introduce new die bonding equipment, tools, and process capabilities.
• Support technology transfer from development to mass production.
• Conduct process characterization, capability studies, and reliability assessments.
• Perform root cause analysis for development-related process challenges.
• Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
• Generate technical documentation, process specifications, and qualification reports.

Skills

Die bond process development

DOE experiments

Process optimization

Root cause analysis

Collaborate with suppliers

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electronic Engineering

Bachelor's degree in Mechatronics Engineering

Bachelor's degree in Manufacturing Engineering

Bachelor's degree in Materials Engineering

Tools

Die bonding equipment

Job description

About the Role

As a Development Die Bond Engineer, you will be responsible for developing, qualifying, and industrializing new die attach technologies, processes, materials, and equipment for semiconductor packaging applications. You will play a key role in bringing new products and advanced packaging solutions from concept to high-volume manufacturing. Working closely with R&D, Product Development, Process Engineering, Quality, and Operations teams, you will drive innovation and ensure robust, scalable, and cost-effective die bond solutions that meet future technology requirements.

What will you do

• Develop and qualify new die bond processes, materials, and assembly technologies.
• Lead process development activities for new semiconductor packages and products.
• Design and execute experiments (DOE) to optimize process performance and reliability.
• Evaluate and introduce new die bonding equipment, tools, and process capabilities.
• Support technology transfer from development to mass production.
• Conduct process characterization, capability studies, and reliability assessments.
• Perform root cause analysis for development-related process challenges.
• Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
• Generate technical documentation, process specifications, and qualification reports.

What will you need

• Bachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.
• 2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better.

We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games.

Our recruitment process is inclusive and accessible to all, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups.

Nexperia is committed to increasing women in management positions to 30% by 2030.

Nexperia is a world-class company in semiconductor development and in-house production.

A proven global player with an entrepreneurial mentality.

At our core is an 12,000+ strong international network with a singular focus.

Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face.

We support, reward and challenge individuals equally, in a dynamic and energetic environment.

Looking to push boundaries in a company where your talents can shine? Join TeamNexperia.