Dicing & Grinding Equipment Engineer (On-Site, Flexible)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Kulim; Presencial; MYR 120.000 - 180.000; Jornada completa

Descripción de la vacante

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd in Kulim is seeking a Staff Equipment Engineer (Dicing & Grinding) to develop and optimize precision dicing and grinding processes with robust SPC and Line of Defense controls. You will collaborate with Process & Equipment engineers to understand capabilities and support product integration and continuous improvement.

This role requires a degree in EE/Mechatronic/Mechanical/Chemical engineering and at least 8 years in manufacturing, with 3–5 years in

Formación

• Degree in EE/Mechatronic/Mechanical/Chemical Engineering.
• Minimum 8 years experience in manufacturing environment.
• Minimum 3–5 years in dicing/grinding process engineering.

Responsabilidades

• Develop and optimize dicing/grinding processes with SPC and LOD controls.
• Perform risk assessments (FMEA) and create/certify procedures.
• Collaborate with Process & Equipment engineers to understand capabilities.
• Support continuous improvement to reduce waste and improve tool uptime.
• Coordinate with RBG to synchronize process changes and plan equipment needs.
• Identify root causes of non-conformances and implement CAPAs.

Conocimientos

Dicing & Grinding

Process Engineering

Manufacturing

Educación

Engineering Degree

Descripción del empleo

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd in Kulim is seeking a Staff Equipment Engineer (Dicing & Grinding) to develop and optimize precision dicing and grinding processes with robust SPC and Line of Defense controls. You will collaborate with Process & Equipment engineers to understand capabilities and support product integration and continuous improvement.

This role requires a degree in EE/Mechatronic/Mechanical/Chemical engineering and at least 8 years in manufacturing, with 3–5 years in