Principal Engineer: Tech Integration & Risk Leadership

Infineon Technologies; Malacca City; On-site; MYR 240,000 - 420,000; Full time

Job summary

Infineon Technologies Malaysia, a global leader in semiconductor solutions, seeks a Principal Engineer to lead risk interaction assessments and integrate front-end/back-end processes within the package platform.

You will drive BOM and process integration, mentor teams, and apply 8D/FTA/Fishbone methodologies to resolve complex issues while collaborating across functions to deliver cutting-edge chip technologies.

Qualifications

• Bachelor's or Master's degree in Engineering or related discipline.
• Familiarity with AI-enabled solutions and data-driven learning is a plus.
• Strong problem-solving using 8D, FTA, Fishbone and other root-cause methods.
• Solid knowledge of SMT manufacturing processes.
• Experience in semiconductor manufacturing or high-tech operations.
• Excellent stakeholder management and cross-functional collaboration.

Responsibilities

• Own and lead Risk Interaction Assessment and Mitigation work packages.
• Drive integration of unit processes including BOM and process integration within the package platform.
• Serve as primary technical interface for Front-End teams on FE/BE interaction and integration.
• Support pre-development activities for new chip technologies.
• Lead and participate in 8D problem-solving to resolve interaction-related issues.
• Provide technical guidance on process interaction and integration topics.

Skills

Risk assessment

8D problem solving

Cross-functional collaboration

SMT manufacturing knowledge

Semiconductor industry experience

Data-driven learning

Stakeholder management

Education

Bachelor's or Master's in Engineering / related discipline

Tools

8D problem solving framework

Fishbone (Ishikawa) analysis

FTA (Fault Tree Analysis)

Job description

Infineon Technologies Malaysia, a global leader in semiconductor solutions, seeks a Principal Engineer to lead risk interaction assessments and integrate front-end/back-end processes within the package platform.

You will drive BOM and process integration, mentor teams, and apply 8D/FTA/Fishbone methodologies to resolve complex issues while collaborating across functions to deliver cutting-edge chip technologies.