Lead Engineer, Wafer Tech & Interconnect Innovation

Infineon Technologies AG; Malacca City; On-site; MYR 90,000 - 130,000; Full time

Job summary

Infineon Technologies AG seeks a technical expert in wafer technology and interconnect to lead optimization projects and collaborate with global wafer fab and backend sites. You will drive process guidelines and share expertise across chip metallization, die bond, and wire bond processes.

The role emphasizes entrepreneurial leadership, cost-effective production, and ability to translate complex interactions for informed decision-making.

Qualifications

• Bachelor’s or Master’s degree in engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Expertise across wafer and assembly technologies: chip metallization, die bond, wire bond.
• Good communication skills to interact with cross-site technical teams.
• Ability to simplify complex technical interactions to enable decision-making.
• Experience in failure analysis, statistical data analysis, design of experiments, and problem-solving methods (8D, 6-Sigma).

Responsibilities

• Apply your technical knowledge within own optimization projects or as project team member of development projects with FE-BE and platform overarching impact.
• Ensure cost effective production by fostering reuse and avoiding complexity before production release.
• Act as an entrepreneur and technical leader in the area of innovation and implementation.
• Closely cooperate with worldwide Infineon wafer fab and backend sites.
• Drive and define the process guideline documentation from lessons learned for interaction between chip and assembly.
• Share know-how concerning process block interactions as trainer.

Skills

Technical leadership

Cross-site collaboration

Communication skills

Problem solving (8D, 6-Sigma)

Education

Bachelor’s or Master’s degree in engineering

Job description

Infineon Technologies AG seeks a technical expert in wafer technology and interconnect to lead optimization projects and collaborate with global wafer fab and backend sites. You will drive process guidelines and share expertise across chip metallization, die bond, and wire bond processes.

The role emphasizes entrepreneurial leadership, cost-effective production, and ability to translate complex interactions for informed decision-making.