Chipfab Process Engineer: Ramp-Up & Yield Leader

Broadcom Inc.; Penang; On-site; MYR 180,000 - 300,000; Full time

Job summary

Broadcom Inc. seeks a senior engineer to lead the ramp-up of new facilities and drive aggressive capacity scaling within strict timelines. You will coordinate cross-functional teams for CM qualification, equipment onboarding, and process definition to enable mass production.

The role requires deep expertise in semiconductor manufacturing, strong leadership, and the ability to manage remote teams while driving yield improvement and cost reduction initiatives.

Qualifications

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or related technical field.

Responsibilities

• Lead ramp-up of new facilities and aggressive capacity scaling within tight project timelines.
• Oversee evaluation, qualification, and onboarding of CM partners, new equipment, and manufacturing processes for mass production.
• Ensure seamless product transfer from NPI to High-Volume Manufacturing and lead handling of product issues on the factory floor.

Skills

Leadership

JMP analysis

Project management

Data-driven decision making

Education

Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering

Tools

Bar Processing equipment (Bar Stacker/unstack)

Scribe & Break

AOI

Pick & Place

JMP software

Job description

Broadcom Inc. seeks a senior engineer to lead the ramp-up of new facilities and drive aggressive capacity scaling within strict timelines. You will coordinate cross-functional teams for CM qualification, equipment onboarding, and process definition to enable mass production.

The role requires deep expertise in semiconductor manufacturing, strong leadership, and the ability to manage remote teams while driving yield improvement and cost reduction initiatives.