ChipFab Product Engineer

Broadcom Inc.; George Town; On-site; MYR 120,000 - 180,000; Full time

Job summary

Broadcom Inc. in Penang, Malaysia, is seeking a ChipFab Product Engineer to lead ramp-up of new facilities, drive qualification of CM partners, and ensure smooth transfer from NPI to high-volume manufacturing.

You will monitor yields, solve CM production issues, and oversee cost reductions through process improvements, data-driven analysis with JMP, and strong cross-functional leadership. The role demands extensive technical background in semiconductor/photonics and proven ability to manage

Qualifications

• Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or related highly technical field.
• 10+ years hands-on engineering and leadership in backend Indium Phosphide InP wafer processing or complex semiconductor/photonics manufacturing.
• Experience leading remote teams and ramping new facilities or production lines.
• Strong expertise in product and process yield improvement and equipment qualification.
• Proficiency in JMP for statistical data analysis and decision-making.
• Excellent communication, negotiation, and project management skills.

Responsibilities

• Lead the team to ramp-up new facilities, ensuring capacity scaling within strict project timelines.
• Lead cross functional evaluation and onboarding of CM partners, new equipment, and manufacturing processes to ensure seamless transition into mass production.
• Drive seamless transfer of products from New Product Introduction to High-Volume Manufacturing, acting as technical owner for issues on the factory floor.
• Monitor production yields across contract manufacturers and drive for improvements.
• Resolve CM engineering, production, and quality issues with robust corrective actions and continuous process improvement initiatives.
• Oversee product costing analysis and identify opportunities for cost reduction through process optimization and yield enhancement.
• Drive data-driven engineering analysis to monitor CM performance and troubleshoot manufacturing deviations.
• Conduct on-site quality audits at partner facilities to enforce SOPs/PCPs and quality standards; lead root cause investigations and track corrective actions.

Skills

Leadership

Cross-functional collaboration

Data analysis

Communication

Education

Engineering degree (Mechanical / E&E / Semiconductor / Photonics)

Tools

JMP

Job description

ChipFab Product Engineer### ChipFab Product EngineerApply: Malaysia-Penang B 1 & 2: Full time: Posted Today: R027548**Please Note:****1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)****2. If you already have a Candidate Account, please Sign-In before you apply.**## **Job Description:****Job Description*** New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.* New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.* New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.* Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.* Line Sustaining, drive for process yield Improvement : Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.* Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.* Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).* Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.**Requirement*** Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.* Minimum 10+ years of hands-on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip-out) or complex semiconductor/photonics manufacturing. Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage.* Strong leadership capabilities with a proven history of managing remote teams, driving cross-functional initiatives, and successfully leading new facility or production line ramp-ups.* Extensive expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.* Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision-making.* Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively. **Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.****If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.**