ChipFab Process Engineer

Broadcom Inc.

Penang

On-site

MYR 180,000 - 300,000

Full time

4 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Broadcom Inc. seeks a senior engineer to lead the ramp-up of new facilities and drive aggressive capacity scaling within strict timelines. You will coordinate cross-functional teams for CM qualification, equipment onboarding, and process definition to enable mass production.

The role requires deep expertise in semiconductor manufacturing, strong leadership, and the ability to manage remote teams while driving yield improvement and cost reduction initiatives.

Qualifications

  • Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or related technical field.

Responsibilities

  • Lead ramp-up of new facilities and aggressive capacity scaling within tight project timelines.
  • Oversee evaluation, qualification, and onboarding of CM partners, new equipment, and manufacturing processes for mass production.
  • Ensure seamless product transfer from NPI to High-Volume Manufacturing and lead handling of product issues on the factory floor.

Skills

Leadership
JMP analysis
Project management
Data-driven decision making

Education

Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering

Tools

Bar Processing equipment (Bar Stacker/unstack)
Scribe & Break
AOI
Pick & Place
JMP software

Job description

Job Description

New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.

New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.

New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.

Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.

Line Sustaining, drive for process yield Improvement: Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.

Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.

Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).

Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.

Requirements

Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.

Minimum 10+ years of hands-on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip-out) or complex semiconductor/photonics manufacturing.

Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage.

Strong leadership capabilities with a proven history of managing remote teams, driving cross-functional initiatives, and successfully leading new facility or production line ramp-ups.

Extensive expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.

Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision-making.

Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively.

Equal Opportunity Statement

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

About Broadcom

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

ChipFab Product Engineer
ChipFab Product Engineer

Broadcom Inc. • Penang

On-site
MYR 180,000 - 280,000
ChipFab Product Engineer
ChipFab Product Engineer

Broadcom • George Town

On-site
MYR 180,000 - 300,000
ChipFab Product Engineer
ChipFab Product Engineer

Broadcom • Seberang Perai

On-site
MYR 180,000 - 320,000
ChipFab Process Engineer
ChipFab Process Engineer

Broadcom • Seberang Perai

On-site
MYR 180,000 - 300,000
ChipFab Process Engineer
ChipFab Process Engineer

Broadcom • George Town

On-site
MYR 180,000 - 320,000
ChipFab Process Engineer
ChipFab Process Engineer

Broadcom Inc. • Seberang Perai

On-site
MYR 180,000 - 300,000
ChipFab Product Engineer
ChipFab Product Engineer

Broadcom Inc. • George Town

On-site
MYR 120,000 - 180,000
Chipfab Process Engineer: Ramp-Up & Yield Leader
Chipfab Process Engineer: Ramp-Up & Yield Leader

Broadcom Inc. • Penang

On-site
MYR 180,000 - 300,000
Chip Fab Process Engineer: Ramp-Up & Yield Excellence
Chip Fab Process Engineer: Ramp-Up & Yield Excellence

Broadcom • George Town

On-site
MYR 180,000 - 300,000
ChipFab Process Engineer: Ramp-Up & Yield Leader
ChipFab Process Engineer: Ramp-Up & Yield Leader

Broadcom • George Town

On-site
MYR 180,000 - 320,000