Packaging Process Engineer for Die/Chip Attach & Ball Attach

Intel Corporation; Kulim; On-site; MYR 120,000 - 180,000; Full time

Job summary

Intel Corporation in Malaysia is seeking a Process Development Engineer specializing in Solder Ball Attach or Chip Attach within the Technology Development Organization. You will work on CAM/SLAM processes covering Die, DRAM, Component Attach, and Deflux, developing materials and processes for new products and test vehicles.

The role requires strong R&D background, DOE, SPC, FMEA, data analysis, and the ability to ramp to high-volume manufacturing while meeting tight schedules.

Qualifications

• BEng/MEng/MSc/PhD in Mechanical, Materials, Chemical, Electrical, Physics or Mechatronics.
• 5 years of experience in electronic packaging or development preferred.
• R&D background preferred with Chip Attach, Deflux or Ball Attach.
• Strong data analysis and problem-solving skills; excellent communication.
• Able to work under tight timelines and pressure.

Responsibilities

• Develop process specifications using DOE and SPC; document improvements in white papers.
• Qualify materials for transfer to high-volume manufacturing.
• Optimize packaging assembly processes to meet quality, cost, yield, and manufacturability requirements.
• Conduct fundamental studies and experiments to characterize materials and processes; assess technology feasibility.
• Collaborate with cross-functional teams to build material technologies on test vehicles and products.

Skills

DOE

SPC

FMEA

Data analysis

Communication

Problem solving

Education

BEng/MEng/MSc/PhD

Job description

Intel Corporation in Malaysia is seeking a Process Development Engineer specializing in Solder Ball Attach or Chip Attach within the Technology Development Organization. You will work on CAM/SLAM processes covering Die, DRAM, Component Attach, and Deflux, developing materials and processes for new products and test vehicles.

The role requires strong R&D background, DOE, SPC, FMEA, data analysis, and the ability to ramp to high-volume manufacturing while meeting tight schedules.