BGA Wire Path Cleaning Technician
NXP Semiconductors
Get more replies from employers
Send a job-specific resume in minutes.
Job summary
NXP Semiconductors is seeking a dedicated team member to support wire bond path and window clamp cleaning activities in our manufacturing operations in Kuala Lumpur. This entry-level role focuses on maintaining process cleanliness and supporting yield improvement while adhering to safety and quality standards.
You will work with a global team and contribute to delivering high-quality, reliable semiconductor products.
Job description
NXP Semiconductors is seeking a dedicated team member to support wire bond path and window clamp cleaning activities in our manufacturing operations in Kuala Lumpur. This entry-level role focuses on maintaining process cleanliness and supporting yield improvement while adhering to safety and quality standards.
You will work with a global team and contribute to delivering high-quality, reliable semiconductor products.
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
